5SGXMA5K1F35I2G

The 5SGXMA5K1F35I2G is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1152-ball BGA package. It integrates a high logic capacity and substantial on-chip memory to address demanding system-level processing and high-density I/O requirements.

As a Stratix V GX device, the series datasheet documents GX transceiver capabilities (series-level) including GX channel speeds up to 14.1 Gbps. This part is specified for industrial temperature operation and RoHS compliance, delivering a combination of logic density, embedded RAM, and high pin-count I/O for complex digital designs.

Key Features

• Core Logic  Approximately 490,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support data buffering, FIFOs, and on-chip storage.
• I/O Capacity  432 user I/O pins to support wide bus interfaces and multiple peripheral connections.
• Transceiver Series Capability  Stratix V GX series-level transceivers support GX channel speeds up to 14.1 Gbps (series datasheet reference).
• Power  Core voltage supply specified from 870 mV to 930 mV, enabling defined low-voltage core operation.
• Package & Mounting  1152-BBGA (FCBGA) / supplier device package 1152-FBGA (35×35), surface-mount device suitable for high-density PCBs.
• Temperature & Grade  Industrial grade with operating temperature range from −40 °C to 100 °C.
• Compliance  RoHS compliant for environmental conformity.

Typical Applications

• High-speed serial communications  Leverage the Stratix V GX series transceiver capabilities for designs requiring multi-gigabit serial links (series-level transceiver specs).
• Network and telecom systems  High logic density and abundant I/O make the device suitable for packet processing, interface bridging, and protocol handling in communication equipment.
• Data processing and acceleration  Large logic resources and on-chip RAM enable complex datapath implementations and buffering for compute-acceleration tasks.

Unique Advantages

• High logic density: The large pool of approximately 490,000 logic elements supports complex state machines, pipelines, and custom datapaths without external logic.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on external memory for many buffering and scratchpad needs.
• Extensive I/O count: 432 I/Os provide flexibility for wide buses, multiple peripherals, and mezzanine-style interfaces on dense boards.
• Industrial temperature rating: Specified −40 °C to 100 °C operation for deployments that require extended ambient range.
• Compact, high-density packaging: 1152-ball FCBGA footprint optimizes board area for high-pin-count designs while supporting surface-mount assembly.
• Environmentally compliant: RoHS compliance helps meet regulatory and manufacturing requirements.

Why Choose 5SGXMA5K1F35I2G?

The 5SGXMA5K1F35I2G combines large-scale programmable logic with substantial embedded memory and a high I/O count in an industrial-temperature, RoHS-compliant FPGA package. It is positioned for designs that require dense logic resources, significant on-chip RAM, and broad I/O connectivity in a compact BGA form factor.

Engineers selecting this Stratix V GX device can rely on the series-level transceiver performance documented in the datasheet alongside the part’s defined voltage and temperature specifications to integrate the device into high-performance digital and communications systems.

Request a quote or submit a procurement inquiry to receive pricing and availability for 5SGXMA5K1F35I2G. Our team can provide lead-time and order details to support your design schedule.