5SGXMA5K1F35C2LG

The 5SGXMA5K1F35C2LG is a Stratix® V GX FPGA from Intel, offered as a high-density programmable logic device in a 1152-BBGA (FCBGA) package. It provides substantial on-chip resources—approximately 490,000 logic elements and roughly 46.08 Mbits of embedded memory—enabling complex logic implementation and large on-chip buffering in a surface-mount form factor.

Designed for commercial-temperature applications, this device supports a wide set of design requirements where logic capacity, on-chip RAM, and a large I/O count are primary considerations. The part is RoHS compliant and is specified for core supply voltages in the 820 mV to 880 mV range.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large-scale, highly parallel logic networks and complex custom silicon functions.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for data buffering, lookup tables, and large state storage within the FPGA fabric.
• I/O Resources  432 user I/O pins to support wide bus interfaces, multiple peripherals, and high pin-count system connections.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type suitable for compact PCB integration.
• Power Supply  Core voltage specified between 820 mV and 880 mV, enabling designs targeting the Stratix V core voltage range.
• Operating Temperature & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant, supporting environmental requirements for lead-free manufacturing.

Unique Advantages

• High logic density: The device's ~490,000 logic elements provide the capacity to consolidate functions that would otherwise require multiple devices, helping reduce board-level BOM and interconnect complexity.
• Significant on‑chip memory: Roughly 46 Mbits of embedded RAM enables large local buffers and state machines without reliance on external memory.
• Generous I/O count: 432 I/Os allow broad connectivity to peripherals, parallel interfaces, and multi-lane subsystems within a single FPGA footprint.
• Compact, manufacturable package: The 1152‑BBGA (35×35 FCBGA) package and surface-mount form factor support high-density PCB layouts and automated assembly.
• Commercial temperature suitability: Specified for 0 °C to 85 °C operation, aligning with many embedded and industrial-adjacent applications that use commercial-grade components.
• Standards-friendly supply and compliance: Core supply range (820–880 mV) and RoHS compliance simplify power design and regulatory adherence.

Why Choose 5SGXMA5K1F35C2LG?

The 5SGXMA5K1F35C2LG positions itself as a high-capacity Stratix V GX FPGA option for designs that require substantial programmable logic, considerable on-chip memory, and a large number of I/O signals in a compact surface-mount package. Its commercial-grade operating temperature range and RoHS compliance make it suitable for mainstream embedded systems and commercial electronic products that demand integration and density.

Choose this Intel Stratix V GX device when your design priorities are logic density, embedded RAM, and extensive I/O in a manufacturable FCBGA package—backed by the Stratix V family documentation and specifications provided by the manufacturer.

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