5SGXMA5K1F35C2LN

The 5SGXMA5K1F35C2LN is a Stratix® V GX field programmable gate array (FPGA) IC offering a high-density programmable fabric. Key on-chip resources include 490,000 logic elements and approximately 46.08 Mbits of embedded memory, with 432 user I/Os for broad system connectivity.

Housed in a 1152‑BBGA (35 × 35) FCBGA surface-mount package and rated for commercial operation (0 °C to 85 °C), this device supplies a low-voltage core operating range of 820 mV to 880 mV and is RoHS compliant.

Key Features

• Core & Logic  Approximately 490,000 logic elements provide high-density programmable logic capacity for complex designs.
• Logic Array Blocks  185,000 logic array blocks (LABs) for structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Capability  432 general-purpose I/Os to interface with external devices and system peripherals.
• Power Supply  Core supply range of 820 mV to 880 mV to match system power-rail requirements.
• Package & Mounting  1152‑BBGA, FCBGA (supplier package: 1152‑FBGA, 35×35) in a surface-mount form factor for compact board designs.
• Temperature Grade  Commercial grade, qualified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density logic integration: Use the large logic-element count and LAB resources to implement complex digital systems and custom accelerators.
• On‑chip buffering and data processing: Approximately 46 Mbits of embedded RAM supports local storage, packet buffering, and streaming data manipulation.
• Multi‑I/O system interfaces: 432 I/Os enable extensive peripheral connectivity and parallel I/O implementations on compact PCBs.

Unique Advantages

• High programmable capacity: 490,000 logic elements enable integration of large, multi-function designs into a single device, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 46.08 Mbits of embedded RAM minimizes external memory dependence for many buffering and local-storage needs.
• Robust I/O count: 432 user I/Os provide flexibility for system-level interfacing without additional I/O expanders.
• Compact assembly: 1152‑BBGA FCBGA packaging in a 35×35 form factor supports dense board layouts and surface-mount manufacturing.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to meet typical commercial product requirements.
• Regulatory readiness: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose 5SGXMA5K1F35C2LN?

The 5SGXMA5K1F35C2LN positions itself as a high-density Stratix® V GX FPGA for designs that require extensive logic resources, substantial on-chip memory, and a high I/O count in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronic products where programmable integration and board-space efficiency are priorities.

Engineers and procurement teams looking to consolidate functionality, reduce external component counts, and leverage a vendor-backed FPGA family will find this device aligned to demanding digital integration tasks while maintaining standard commercial operating parameters.

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