5SGXMA5K1F35C2N

The 5SGXMA5K1F35C2N is a Stratix® V GX field-programmable gate array (FPGA) offered in a commercial temperature grade. It combines large programmable logic capacity with substantial embedded memory and a high-count I/O footprint in a 1152-ball FCBGA package.

This device is targeted at designs that require large on-chip resources and flexible I/O, providing a platform for implementing complex digital systems where integration and scalability matter.

Key Features

• Logic Capacity — 490,000 logic elements for high-density programmable logic implementations.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive algorithms.
• I/O Density — 432 I/O pins to accommodate extensive peripheral, memory, and interface connectivity.
• Package — 1152-ball FCBGA (1152-FBGA, 35 × 35 mm) surface-mount package for compact, high-pin-count system integration.
• Power Supply — Core voltage range from 870 mV to 930 mV, enabling defined power planning for FPGA core rails.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance — Surface-mount device; RoHS compliant for regulatory alignment.

Typical Applications

• High-density logic systems — Use the device's 490,000 logic elements to implement large-scale custom datapaths, control logic, and hardware accelerators.
• Memory-intensive designs — Approximately 46 Mbits of embedded RAM supports buffering, packet queues, and working memory for real-time processing.
• Complex I/O aggregation — With 432 I/Os and a 1152-ball FCBGA package, the device is suited for applications requiring extensive peripheral and interface connections.

Unique Advantages

• High programmable capacity: 490,000 logic elements provide headroom for large, feature-rich FPGA implementations without external logic.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
• High I/O count in a compact package: 432 I/Os in a 1152-ball FCBGA (35 × 35 mm) enable complex board-level connectivity while maintaining a compact footprint.
• Predictable power planning: Defined core supply range (870 mV–930 mV) simplifies voltage-rail design and power-supply selection.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation to meet mainstream embedded and communications product temperature requirements.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements for many markets.

Why Choose 5SGXMA5K1F35C2N?

The 5SGXMA5K1F35C2N provides a balance of large programmable logic resources, significant embedded memory, and a high I/O count in a surface-mount 1152-ball FCBGA package. Its commercial temperature rating and defined core voltage range make it suitable for production systems that require predictable electrical and thermal design.

This device is an appropriate choice for engineering teams building scalable, integration-focused FPGA solutions that rely on abundant on-chip resources and flexible connectivity while maintaining RoHS compliance and standard commercial temperature operation.

Request a quote or submit a pricing inquiry today to evaluate 5SGXMA5K1F35C2N for your next high-density FPGA design.