5SGXMA5K1F35I2N

The 5SGXMA5K1F35I2N is a Stratix® V GX field programmable gate array (FPGA) designed for high-density programmable logic and on-chip memory integration. This industrial-grade device provides 490,000 logic elements and approximately 46 Mbits of embedded RAM, paired with 432 I/Os in a 1152-BBGA (FCBGA) package.

With a core voltage supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, the part targets designs that require substantial logic capacity, significant embedded memory, and robust I/O capability within industrial temperature environments.

Key Features

• Core density — 490,000 logic elements provide substantial programmable logic resources for complex designs.
• Embedded memory — Approximately 46 Mbits of on-chip RAM to support large buffers, tables, and state storage.
• I/O capacity — 432 user I/Os to accommodate wide parallel interfaces and numerous peripheral connections.
• Package — 1152-BBGA, FCBGA format; supplier device package listed as 1152-FBGA (35×35) for dense board integration.
• Power requirements — Core voltage supply range of 870 mV to 930 mV for system power planning.
• Industrial temperature rating — Specified to operate from −40 °C to 100 °C for deployment in demanding environments.
• Mounting — Surface-mount device suitable for modern PCB assembly processes.
• Standards compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density programmable logic systems — Leverages 490,000 logic elements to implement large-scale custom logic and hardware acceleration functions.
• On-chip buffering and memory-intensive designs — Approximately 46 Mbits of embedded RAM supports buffering, packet queues, and large lookup tables.
• Multi-interface platforms — 432 I/Os provide the connectivity required for complex peripheral and front-end interfacing.

Unique Advantages

• High logic capacity: 490,000 logic elements enable consolidation of complex functions into a single device, reducing BOM and board-level complexity.
• Significant on-chip memory: Approximately 46 Mbits of RAM minimizes external memory dependence for many buffering and storage needs.
• Extensive I/O support: 432 I/Os allow designs to support multiple parallel buses, sensors, or external devices without additional I/O expanders.
• Industrial-grade operation: Rated from −40 °C to 100 °C to handle temperature extremes commonly encountered in industrial deployments.
• Compact, high-density package: 1152-BBGA (1152-FBGA 35×35) enables high pin counts in a space-efficient footprint for dense board layouts.
• RoHS compliant: Meets common environmental requirements for contemporary electronic products.

Why Choose 5SGXMA5K1F35I2N?

The 5SGXMA5K1F35I2N combines high programmable logic capacity, substantial embedded memory, and a large I/O complement in an industrial-temperature-rated FPGA package. It is well suited for engineering teams needing to implement complex logic, large buffers, and dense peripheral connectivity within a single, surface-mount device.

Selected for designs that require scalability in logic and memory resources while maintaining industrial operating range and RoHS compliance, this Stratix® V GX device supports system-level consolidation and straightforward power planning with its defined supply voltage range.

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