5SGXMA5H3F35I4WN

The 5SGXMA5H3F35I4WN is a high-density Stratix V GX FPGA from Intel, offering a large programmable fabric and substantial on-chip memory for complex digital designs. Its architecture provides a combination of extensive logic capacity, high I/O count, and industrial-grade operating conditions for designs that require sustained performance across a wide temperature range.

Targeted at designs that need significant logic resources and I/O connectivity, this device delivers a platform for compute-intensive, I/O-heavy systems where on-chip memory and logic density are primary design drivers.

Key Features

• Core Logic Capacity  Approximately 490,000 logic elements for implementing large, complex custom logic and state machines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, packet handling, and algorithm acceleration without relying solely on external memory.
• I/O Count  552 user I/O pins to support wide parallel interfaces and multi‑lane connectivity requirements.
• Power Supply  Low-voltage core operation with a supply range of 820 mV to 880 mV, compatible with modern low-voltage power rails.
• Package & Mounting  1152-ball BGA package (1152-BBGA / 1152-FBGA, 35×35) in an FCBGA form factor; surface-mount implementation for high-density board layouts.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance  RoHS-compliant construction for regulatory and environmental alignment.

Typical Applications

• High‑density digital acceleration  Implement large custom datapaths and accelerators using the device's ~490k logic elements and ~46 Mbits of embedded memory.
• I/O-intensive systems  Deploy in designs requiring many parallel interfaces or multi-lane connectivity leveraging the 552 available I/Os.
• Industrial and harsh-environment equipment  Use in control and processing equipment that requires operation across -40 °C to 100 °C.

Unique Advantages

• High logic density: The large logic-element count enables consolidation of multiple functions into a single device, simplifying board-level design.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory reduces dependence on external memory for buffering and local storage.
• Extensive I/O availability: 552 I/Os support wide parallel interfaces and flexible I/O partitioning for complex system integration.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in thermally challenging installations.
• Low-voltage core support: Core supply between 820 mV and 880 mV aligns with modern low-power power-rail designs.
• Manufactured by Intel: Product comes from a well-established semiconductor supplier, with published device documentation available.

Why Choose 5SGXMA5H3F35I4WN?

The 5SGXMA5H3F35I4WN combines high logic capacity, sizable embedded memory, and a large I/O complement in a single industrial-grade FPGA package. It is suited for engineers and system designers who need to implement complex, high-density logic and memory structures while maintaining broad interface capability and robust thermal operation.

This device provides a scalable hardware platform for designs that require consolidation of multiple functions into a single programmable device, offering measurable benefits in board complexity and integration for demanding embedded and industrial applications.

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