5SGXMA5H3F35I3WN

The 5SGXMA5H3F35I3WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers very high logic density with extensive on-chip embedded memory and a large I/O count in a surface-mount 1152-BBGA (35×35) package.

Designed for applications that require substantial programmable logic, significant embedded RAM, and robust I/O capability, this industrial-grade device combines the Stratix V GX family architecture with specifications aimed at demanding embedded and systems designs.

Key Features

• Logic Capacity — 490,000 logic elements provided for high-density, programmable logic implementations.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large data buffers, FIFOs, and memory-intensive algorithms.
• I/O Resources — 552 user I/O pins to support wide parallel interfaces and high port-count connectivity.
• Power Supply — Core voltage support from 820 mV to 880 mV, allowing designers to plan power delivery and sequencing to match device requirements.
• Package & Mounting — 1152-BBGA (FCBGA) surface-mount package, supplier package listed as 1152-FBGA (35×35), for compact, high-pin-count board implementations.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets RoHS environmental compliance requirements.
• Stratix V GX Family — Part of the Stratix V GX family, which includes devices with transceiver and high-performance switching characteristics (refer to the Stratix V device documentation for detailed transceiver options and speed grades).

Typical Applications

• High-density digital processing — Large logic capacity and substantial on-chip RAM make this device suitable for complex DSP, packet processing, and algorithm acceleration.
• Communications and networking — High I/O count and Stratix V GX family transceiver capability support line cards, switching fabrics, and protocol offload implementations.
• Industrial control and automation — Industrial temperature rating and robust I/O allow deployment in factory automation, motor control, and industrial instrumentation.
• Test and measurement — Ample logic and memory resources enable high-channel-count acquisition, real-time processing, and custom instrumentation functions.

Unique Advantages

• High logic density: 490,000 logic elements provide room for large, integrated designs without splitting functionality across multiple devices.
• Large on-chip memory: Approximately 46 Mbits of embedded RAM reduces external memory dependence and speeds data-path operations.
• Extensive I/O capability: 552 I/O pins support broad system interfacing and high port-count designs, simplifying board-level routing and integration.
• Industrial robustness: Specified operation from −40 °C to 100 °C enables reliable operation in industrial environments.
• Compact, high-pin-count package: 1152-BBGA (35×35) FCBGA package balances pin density and board-space efficiency for complex system boards.
• Standards-based, documented family: As a Stratix V GX family device, designers can reference family-level datasheets for electrical and switching characteristics and transceiver options.

Why Choose 5SGXMA5H3F35I3WN?

The 5SGXMA5H3F35I3WN combines large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-temperature, RoHS-compliant package. It is intended for engineers and system designers who need a single-device solution to implement complex, high-throughput digital logic, memory-intensive data paths, and wide system interfacing while maintaining a compact board footprint.

Backed by the Stratix V GX device documentation and Intel’s platform, this FPGA is suited to development projects that require scalability within the Stratix V family, predictable electrical characteristics, and the ability to support demanding embedded and systems-level designs.

Request a quote or submit a pricing request to move your design forward with the 5SGXMA5H3F35I3WN FPGA.