5SGXMA5H3F35I4

The 5SGXMA5H3F35I4 is an Intel Stratix V GX family FPGA supplied in a 1152-ball BGA package. It provides very high logic capacity and substantial embedded memory, combined with a large I/O count and industrial temperature grading for demanding system designs.

This device targets designs that require dense programmable logic and on-chip RAM while operating across a broad industrial temperature range and a low-voltage core supply. Its characteristics make it suitable for complex digital systems that need high integration and extensive I/O connectivity.

Key Features

• Core Logic  Approximately 490,000 logic elements (logic cells) for implementing large-scale custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support packet buffering, FIFOs, lookup tables, and other memory-intensive functions.
• I/O Capacity  552 I/O pins to accommodate wide parallel interfaces, multi-lane connections, and extensive external device interconnects.
• Package & Mounting  1152-ball BGA (Supplier device package: 1152-FBGA, 35×35) surface-mount package for high-density board integration.
• Power  Core voltage supply range of 820 mV to 880 mV, supporting low-voltage core operation.
• Temperature & Grade  Industrial temperature grade rated for operation from −40 °C to 100 °C.
• Standards Compliance  RoHS-compliant manufacturing.
• Series Characteristics (datasheet)  Stratix V GX family device documentation lists available transceiver speed grades for the family (examples in the device datasheet include GX channel rates such as 14.1 Gbps and 12.5 Gbps), and provides full electrical and switching characteristic coverage for device selection and design.

Typical Applications

• Complex digital systems  Leverage ~490,000 logic elements and approximately 46 Mbits of embedded memory to implement large custom datapaths and control logic.
• High I/O designs  Use the 552 I/O pins for multi-channel interfaces, parallel buses, and extensive external connectivity.
• Industrial-grade deployments  Designed for systems that require operation across −40 °C to 100 °C with industrial-grade component selection.

Unique Advantages

• High integration density: The large logic element count and substantial on-chip RAM reduce the need for external logic and memory, simplifying board-level design.
• Extensive I/O resources: 552 I/O pins enable complex multi-lane and multi-device interfaces without extensive external multiplexing.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in thermally challenging environments.
• Compact surface-mount package: The 1152-ball BGA (35×35) provides a compact form factor for space-constrained PCBs while delivering high pin count.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports modern low-voltage FPGA core architectures.
• Regulatory compliance: RoHS-compliant construction supports regulatory and manufacturing requirements.

Why Choose 5SGXMA5H3F35I4?

The 5SGXMA5H3F35I4 delivers a combination of high logic capacity, significant embedded memory, and a large I/O count in a compact 1152-ball BGA package, all rated for industrial temperature operation. This blend of specifications makes it an appropriate choice for engineers designing complex, high-density programmable systems that require substantial on-chip resources and robust operation across a wide temperature range.

Backed by the Stratix V GX device family datasheet coverage for electrical and switching characteristics, this FPGA is suitable for projects that need detailed device-level specifications to guide power, timing, and thermal design decisions.

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