5SGXMA5H3F35I3N

The 5SGXMA5H3F35I3N is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. It provides a high logic capacity device with a large on‑chip memory footprint and substantial I/O capability for demanding industrial applications.

Built for designs that require significant programmable logic, embedded RAM and broad I/O, this device is offered in an industrial temperature grade and operates with a defined core supply voltage range for system power planning.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large custom logic and complex combinational/sequential designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, lookup tables, and temporary data storage.
• I/O Density  552 I/O pins to support extensive board‑level connectivity and interface options.
• Package  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) surface‑mount package for compact, high‑density board designs.
• Power  Defined core supply range of 0.82 V to 0.88 V to guide power subsystem design.
• Operating Temperature  Industrial grade operation from -40°C to 100°C for use in temperature‑sensitive environments.
• Mounting  Surface mount package suitable for modern PCB assembly flows.

Typical Applications

• High‑density programmable compute  Implement custom datapaths and pipelines using the device's ~490,000 logic elements and embedded RAM.
• Industrial control and automation  Leverage industrial temperature rating and extensive I/O for robust control, monitoring, and interface tasks.
• Board‑level integration and prototyping  High I/O count and compact 1152‑BBGA package enable tight integration of complex systems on modern PCBs.
• Data buffering and on‑chip storage  Use approximately 46 Mbits of embedded memory for FIFOs, frame buffers, and intermediate storage in processing chains.

Unique Advantages

• High logic density: 490,000 logic elements provide the capacity to implement large, complex designs without partitioning across multiple devices.
• Substantial on‑chip RAM: Approximately 46 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 552 I/O pins support diverse peripheral, sensor, and interface connections directly at the FPGA.
• Industrial temperature range: Rated from -40°C to 100°C to meet demanding environmental requirements.
• Compact high‑density package: 1152‑BBGA (35×35) surface‑mount package enables high pin‑count implementations in a manageable PCB footprint.
• Defined core supply range: Core voltage specification of 0.82–0.88 V simplifies power budgeting and design.

Why Choose 5SGXMA5H3F35I3N?

The 5SGXMA5H3F35I3N positions itself where high logic capacity, sizeable on‑chip RAM and broad I/O converge in an industrial‑grade Stratix V GX device. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of embedded memory and 552 I/O make it suitable for complex, integration‑heavy designs that demand board‑level consolidation.

For engineering teams designing industrial systems, high‑density data paths, or advanced control solutions, this device offers a defined power envelope, a compact high‑pin package, and a temperature rating aligned with harsh operating conditions—helping reduce external components and streamline system architecture.

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