5SGXMA5H3F35I4N

The 5SGXMA5H3F35I4N is a Stratix® V GX Field Programmable Gate Array (FPGA) provided in a 1152‑BBGA FCBGA package. It delivers high on‑chip capacity and I/O density for industrial designs that require substantial programmable logic, embedded memory, and robust thermal range.

With approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 552 user I/O, this device targets applications that need dense logic integration, extensive interfacing, and reliable operation across an industrial temperature range.

Key Features

• High-density logic  Approximately 490,000 logic elements to implement large-scale digital functions and complex custom logic.
• Embedded memory  Approximately 46 Mbits of on-chip RAM for buffering, packet processing, and large lookup tables without external memory.
• Generous I/O  552 user I/O pins to support wide parallel interfaces, multiple peripherals, and high system connectivity.
• Package and mounting  1152‑BBGA (FCBGA) supplier device package: 1152‑FBGA (35×35), surface mount for compact board integration.
• Power supply  Core voltage range specified at 820 mV to 880 mV to match targeted system power rails and thermal designs.
• Industrial grade operation  Rated for −40 °C to 100 °C operating temperature for deployment in industrial environments.
• Environmental compliance  RoHS‑compliant construction to support regulatory and manufacturing requirements.

Typical Applications

• High-density signal processing  Implement large DSP pipelines and custom accelerators using abundant logic elements and embedded RAM.
• Telecommunications and networking  Support wide data paths and multiple interface lanes with the device’s high I/O count and on‑chip memory buffering.
• Industrial control and automation  Deploy in factory and equipment control systems that require industrial temperature operation and extensive I/O connectivity.
• Data plane acceleration  Offload deterministic, latency-sensitive tasks to FPGA logic with plentiful resources for packet processing and stateful engines.

Unique Advantages

• Large programmable resource pool: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and lookup tasks.
• Extensive external connectivity: 552 I/O provide flexibility for parallel buses, multiple transceivers, and mixed-signal front ends.
• Industrial temperature capability: Rated −40 °C to 100 °C for reliable operation across harsh field environments.
• Compact FCBGA package: 1152‑BBGA (35×35) package balances high pin count with a small board footprint for space-constrained systems.
• Low-voltage core: Core supply range of 0.82–0.88 V supports modern power-optimized designs.

Why Choose 5SGXMA5H3F35I4N?

The 5SGXMA5H3F35I4N positions itself as a high-capacity, industrial‑grade FPGA option where on‑chip logic density, embedded memory, and large I/O capability are primary design drivers. Its 1152‑BBGA package and specified voltage and temperature ranges make it suitable for industrial systems that require a compact, high‑resource programmable device.

Designers and system architects targeting high‑logic, high‑I/O applications will find this device suitable for consolidating functions, reducing external components, and maintaining operation across demanding environmental conditions. Its RoHS compliance further supports modern manufacturing and supply requirements.

Request a quote or submit an RFQ to obtain pricing, lead time, and availability for the 5SGXMA5H3F35I4N.