5SGXMA4K3F40I4G

The 5SGXMA4K3F40I4G is a Stratix V GX field programmable gate array (FPGA) IC designed for designs requiring high logic density, substantial on‑chip memory, and a large I/O complement. This industrial‑grade, surface‑mount FCBGA device delivers 420,000 logic elements and approximately 37.9 Mbits of embedded memory in a 1517‑BBGA (1517‑FBGA, 40×40) package.

With an operating temperature range of −40 °C to 100 °C and a core voltage supply range of 820 mV to 880 mV, this device is targeted at applications that need robust thermal tolerance, extensive I/O, and significant logic and memory resources.

Key Features

• Core & Logic  420,000 logic elements support large, complex FPGA implementations and deep feature integration within a single device.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM provide substantial capacity for buffering, packet storage, and algorithm state.
• I/O Density  600 user I/O pins enable wide parallel interfaces and flexible external connectivity for high‑channel designs.
• Package & Mounting  1517‑BBGA (1517‑FBGA, 40×40) FCBGA package in a surface‑mount form factor for compact board integration.
• Power  Core voltage supply range from 820 mV to 880 mV aligns with low‑voltage FPGA core requirements.
• Temperature & Grade  Industrial grade device specified for operation from −40 °C to 100 °C for deployment in demanding thermal environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic integration  Large FPGA designs that consolidate multiple functions onto a single device, leveraging 420,000 logic elements to reduce board count.
• Memory‑intensive signal processing  Algorithms and pipelines that require substantial on‑chip buffering and fast local memory access using approximately 37.9 Mbits of embedded RAM.
• I/O‑heavy systems  Systems requiring hundreds of parallel interfaces or broad external connectivity, enabled by 600 available I/O pins.
• Industrial control and automation  Deployments that need industrial temperature range operation and robust FPGA resources for real‑time control, monitoring, and data handling.

Unique Advantages

• Large logic capacity: 420,000 logic elements enable integration of complex functions and larger designs into a single FPGA, simplifying system architecture.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory and improves deterministic data throughput for buffering and processing tasks.
• Extensive I/O: 600 I/O pins provide flexibility for interfacing with multiple high‑pin‑count peripherals, parallel buses, and mezzanine connections.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature‑variable environments.
• Compact FCBGA package: The 1517‑BBGA (40×40) FCBGA offers a dense package option for space‑constrained system boards while enabling high interconnect density.
• RoHS compliant: Conforms to lead‑free manufacturing requirements for regulated environments.

Why Choose 5SGXMA4K3F40I4G?

The 5SGXMA4K3F40I4G combines large logic resources, substantial embedded memory, and a high pin count within an industrial‑grade Stratix V GX FPGA package. It is well suited for engineering teams building complex, memory‑demanding, and I/O‑rich systems where consolidation of functionality onto a single device reduces BOM complexity and simplifies board design.

Designed for long‑running, thermally challenging applications, this device provides a balance of dense logic, on‑chip RAM capacity, and robust I/O capability backed by the Stratix V family specifications.

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