5SGXMA4K3F40I3N

The 5SGXMA4K3F40I3N is a Stratix V GX family field‑programmable gate array (FPGA) in a 1517‑BBGA (1517‑FBGA, 40×40) package designed for industrial applications. It delivers very large logic capacity and on‑chip memory combined with a high I/O count and a low core voltage range for dense, power‑aware FPGA designs.

This device is suitable for designs that require extensive programmable logic, substantial embedded RAM, and broad I/O connectivity within an industrial temperature envelope.

Key Features

• High logic capacity — 420,000 logic elements to implement large‑scale digital designs and complex custom logic functions.
• Embedded memory — approximately 37.9 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑centric processing.
• Dense I/O — 600 I/O pins to support extensive external interfacing and parallel connectivity.
• Family transceiver capability — Stratix V GX family transceiver speed grades include GX channel options up to 14.1 Gbps (as defined in the Stratix V device datasheet).
• Low‑voltage core — specified core supply range of 820 mV to 880 mV for core power delivery planning.
• Industrial temperature range — rated operating temperature from −40 °C to 100 °C for reliable operation in industrial environments.
• Package and mounting — 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), surface mount for PCB integration.
• Regulatory compliance — RoHS compliant.

Typical Applications

• High‑speed communications — Use family transceiver capabilities (GX grades) together with the device’s high I/O to implement networking, telecom, and data transport interfaces.
• Compute and signal processing — Leverage 420,000 logic elements and ~37.9 Mbits of embedded memory for high‑density DSP pipelines, packet processing, and custom accelerator logic.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and extensive I/O make it suitable for rugged control systems and real‑time instrumentation.

Unique Advantages

• Substantial programmable logic: 420,000 logic elements provide the headroom for complex system integration on a single device, reducing external components.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM enable local buffering and high‑throughput data handling without immediate external memory dependency.
• High I/O density: 600 I/O pins simplify interfacing to multiple peripherals, buses, and parallel data paths.
• Industrial readiness: Device grade and operating range (−40 °C to 100 °C) support deployment in demanding industrial environments.
• Power planning clarity: Defined core voltage range (820 mV–880 mV) helps with accurate power delivery and thermal design.
• Compliant and mountable: RoHS compliance and a standard 1517‑FBGA (40×40) surface‑mount package enable manufacturable, regulation‑aware designs.

Why Choose 5SGXMA4K3F40I3N?

The 5SGXMA4K3F40I3N brings a balance of high logic density, substantial embedded RAM, and broad I/O in an industrial‑rated Stratix V GX FPGA. Its package and power characteristics support board‑level integration where space, thermal, and power delivery constraints are important.

This device is suited for engineering teams building high‑performance communications, signal processing, and industrial control systems that require a scalable FPGA platform and verifiable electrical characteristics from the Stratix V family.

Request a quote or submit an inquiry for pricing and availability for part number 5SGXMA4K3F40I3N.