5SGXMA4K3F40I3LN

The 5SGXMA4K3F40I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers a high-density programmable fabric—420,000 logic elements—combined with a large amount of on-chip memory and extensive I/O to address demanding industrial and high-density system designs.

Designed for applications that require significant logic capacity, on-chip memory, and a high I/O count, this Stratix V GX device is specified for industrial temperature operation and features a low core voltage operating window for optimized power delivery.

Key Features

• Core Logic  420,000 logic elements for implementing complex digital logic and large programmable datapaths.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Capacity  600 user I/O pins to interface with a wide range of peripherals, external memory, and system devices.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting type for compact, high-density board designs.
• Power Supply  Core voltage supply range specified from 820 mV to 880 mV for the device core.
• Operating Temperature  Industrial-grade operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Use the industrial temperature rating and high I/O count for control, sensor aggregation, and machine-automation interfaces.
• High-Density Signal Processing  Leverage 420,000 logic elements and on-chip RAM for compute-heavy DSP blocks, packet processing, and custom acceleration kernels.
• Communications Infrastructure  Large logic capacity and extensive I/O support complex protocol handling, packet buffering, and system-level integration in network equipment.

Unique Advantages

• High Logic Integration: 420,000 logic elements reduces the need for multiple discrete devices when implementing large, integrated systems.
• Substantial On-Chip Memory: Approximately 37.9 Mbits of embedded RAM enables larger state storage and buffering without immediate reliance on external memory.
• Extensive I/O Count: 600 I/Os provide flexibility to connect multiple peripherals, interfaces, and external devices directly to the FPGA fabric.
• Industrial Temperature Range: Rated from –40 °C to 100 °C for use in temperature-challenging deployments.
• Compact, High-Density Package: 1517-BBGA FCBGA (1517-FBGA 40×40) balances high pin count with a compact board footprint for space-constrained systems.

Why Choose 5SGXMA4K3F40I3LN?

The 5SGXMA4K3F40I3LN positions itself as a high-density Stratix V GX FPGA option for designers requiring extensive programmable logic, substantial embedded memory, and a large number of I/Os in an industrial-grade device. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 600 I/Os supports complex processing, buffering, and interfacing tasks within a single package.

Available in a 1517-BBGA FCBGA surface-mount package and specified for industrial temperature operation, this device is suited to system integrators and engineers building robust, compact solutions that demand high logic capacity and board-level I/O flexibility.

Request a quote or submit a pricing inquiry for the 5SGXMA4K3F40I3LN to evaluate availability and lead times for your next design.