5SGXMA5N3F40I3LN

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA

Quantity 284 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N3F40I3LN – Stratix® V GX FPGA, 490,000 logic elements

The 5SGXMA5N3F40I3LN is an Intel Stratix V GX field-programmable gate array (FPGA) offered in an industrial-grade FCBGA package. It delivers very high logic capacity with significant on-chip memory and a large I/O count for complex, high-density programmable designs.

Key device-level characteristics include approximately 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 600 I/Os. The device is rated for industrial operating temperatures and a low-voltage core supply range, making it suitable for demanding environments that require substantial programmable logic and system integration.

Key Features

  • Core Logic — Approximately 490,000 logic elements providing high-density programmable fabric for complex digital designs.
  • Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for large buffering, lookup tables, and state storage.
  • I/O Capacity — 600 user I/Os to support wide external interfaces and high pin-count system connectivity.
  • Package and Mounting — 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
  • Power — Core voltage supply range from 820 mV to 880 mV for the device core.
  • Temperature Grade — Industrial operating temperature range of −40 °C to 100 °C for extended-environment applications.
  • Regulatory — RoHS compliant.
  • Series Transceiver Options (series-level information) — Stratix V GX family documentation lists transceiver speed grades (for example, GX channels up to 14.1 Gbps depending on speed grade), as provided in the device family datasheet.

Typical Applications

  • High-density digital systems — Use where large logic count and abundant on-chip memory are required for complex FPGA algorithms and control logic.
  • Communications and networking — Applicable for designs that leverage Stratix V GX family transceiver options and high I/O counts for packet processing and interface aggregation.
  • Industrial control and instrumentation — Industrial temperature rating and robust packaging support deployment in demanding ambient conditions and equipment.

Unique Advantages

  • High logic and memory density: Approximately 490,000 logic elements and ~46.08 Mbits of embedded RAM enable consolidation of large digital functions into a single device.
  • Extensive I/O support: 600 I/Os allow broad connectivity to peripherals, multi-lane interfaces, and parallel buses without external expander logic.
  • Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in extended-temperature environments.
  • Compact, surface-mount FCBGA package: 1517-pin FBGA package (40×40 supplier package) offers a dense footprint for board-level integration while retaining high pin count.
  • Low-voltage core operation: 820 mV–880 mV supply range for the device core supports modern power-optimized system designs.
  • RoHS compliant: Meets standard environmental compliance for regulated assemblies.

Why Choose 5SGXMA5N3F40I3LN?

This Stratix V GX FPGA balances very high programmable logic capacity, substantial embedded memory, and a large I/O complement in an industrial-temperature, surface-mount FCBGA packaging. It is well suited for system designs that require dense logic integration, significant on-chip buffering and state storage, and broad external connectivity under extended-temperature conditions.

Designers and procurement teams targeting scalable, high-capacity programmable logic solutions will find the 5SGXMA5N3F40I3LN appropriate for demanding communications, industrial, and complex digital-processing applications where consolidation of functions and robust operating range are priorities.

If you would like pricing, availability, or a formal quote for 5SGXMA5N3F40I3LN, submit a request or inquiry to receive details tailored to your project requirements.

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