5SGXMA5N3F40I3LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 284 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N3F40I3LN – Stratix® V GX FPGA, 490,000 logic elements
The 5SGXMA5N3F40I3LN is an Intel Stratix V GX field-programmable gate array (FPGA) offered in an industrial-grade FCBGA package. It delivers very high logic capacity with significant on-chip memory and a large I/O count for complex, high-density programmable designs.
Key device-level characteristics include approximately 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 600 I/Os. The device is rated for industrial operating temperatures and a low-voltage core supply range, making it suitable for demanding environments that require substantial programmable logic and system integration.
Key Features
- Core Logic — Approximately 490,000 logic elements providing high-density programmable fabric for complex digital designs.
- Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for large buffering, lookup tables, and state storage.
- I/O Capacity — 600 user I/Os to support wide external interfaces and high pin-count system connectivity.
- Package and Mounting — 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
- Power — Core voltage supply range from 820 mV to 880 mV for the device core.
- Temperature Grade — Industrial operating temperature range of −40 °C to 100 °C for extended-environment applications.
- Regulatory — RoHS compliant.
- Series Transceiver Options (series-level information) — Stratix V GX family documentation lists transceiver speed grades (for example, GX channels up to 14.1 Gbps depending on speed grade), as provided in the device family datasheet.
Typical Applications
- High-density digital systems — Use where large logic count and abundant on-chip memory are required for complex FPGA algorithms and control logic.
- Communications and networking — Applicable for designs that leverage Stratix V GX family transceiver options and high I/O counts for packet processing and interface aggregation.
- Industrial control and instrumentation — Industrial temperature rating and robust packaging support deployment in demanding ambient conditions and equipment.
Unique Advantages
- High logic and memory density: Approximately 490,000 logic elements and ~46.08 Mbits of embedded RAM enable consolidation of large digital functions into a single device.
- Extensive I/O support: 600 I/Os allow broad connectivity to peripherals, multi-lane interfaces, and parallel buses without external expander logic.
- Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in extended-temperature environments.
- Compact, surface-mount FCBGA package: 1517-pin FBGA package (40×40 supplier package) offers a dense footprint for board-level integration while retaining high pin count.
- Low-voltage core operation: 820 mV–880 mV supply range for the device core supports modern power-optimized system designs.
- RoHS compliant: Meets standard environmental compliance for regulated assemblies.
Why Choose 5SGXMA5N3F40I3LN?
This Stratix V GX FPGA balances very high programmable logic capacity, substantial embedded memory, and a large I/O complement in an industrial-temperature, surface-mount FCBGA packaging. It is well suited for system designs that require dense logic integration, significant on-chip buffering and state storage, and broad external connectivity under extended-temperature conditions.
Designers and procurement teams targeting scalable, high-capacity programmable logic solutions will find the 5SGXMA5N3F40I3LN appropriate for demanding communications, industrial, and complex digital-processing applications where consolidation of functions and robust operating range are priorities.
If you would like pricing, availability, or a formal quote for 5SGXMA5N3F40I3LN, submit a request or inquiry to receive details tailored to your project requirements.

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