5SGXMA5N3F40I3N

The 5SGXMA5N3F40I3N is an Intel Stratix V GX field programmable gate array (FPGA) in a 1517-FBGA (40×40) surface-mount package. It delivers a large programmable fabric—490,000 logic elements—and substantial embedded memory, targeting designs that require high logic density, extensive I/O, and industrial-temperature operation.

Designed for integration into demanding systems, this industrial-grade Stratix V GX device combines high logic capacity, approximately 46 Mbits of on-chip RAM, and up to 600 I/O pins to support complex digital processing, system integration, and dense interfacing requirements.

Key Features

• Logic Capacity  490,000 logic elements for large, complex programmable designs.
• Embedded Memory  Approximately 46 Mbits of embedded memory to support on-chip buffering, state storage, and local data processing.
• I/O Density  Up to 600 I/O pins to accommodate wide interfaces, multi-channel connectivity, and board-level integration.
• Package & Mounting  1517-BBGA / 1517-FBGA (40×40) FCBGA surface-mount package for high-density board layouts.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
• Supply Voltage  Core/primary voltage specified between 820 mV and 880 mV for precise power-domain design.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Family  Part of the Stratix V GX series; datasheet series information describes device electrical and switching characteristics and available speed grade options for Stratix V GX devices.

Typical Applications

• High-density logic implementations  Systems that require extensive programmable logic and large on-chip memory for complex algorithms and functions.
• Dense I/O and system integration  Boards and subsystems needing up to 600 I/Os for wide parallel interfaces, multi-lane connectivity, or large peripheral arrays.
• Industrial equipment and instrumentation  Deployments that benefit from industrial temperature operation (−40 °C to 100 °C) and surface-mount packaging for rugged system designs.
• Compact, high-performance FPGA modules  Applications where a high logic count and substantial embedded RAM are required within a compact FCBGA package footprint.

Unique Advantages

• High logic and memory density:  490,000 logic elements and approximately 46 Mbits of embedded memory enable integration of large functions on a single device, reducing board-level complexity.
• Extensive I/O capacity:  Up to 600 I/O pins support complex interfacing and multi-channel designs without external multiplexing.
• Industrial-ready thermal range:  Rated −40 °C to 100 °C for reliable operation in demanding ambient conditions.
• Compact FCBGA package:  1517-FBGA (40×40) surface-mount package supports dense PCB layouts and modern system integration practices.
• Controlled core supply range:  Specified 820 mV–880 mV voltage supply enables precise power-domain planning and predictable core behavior.
• RoHS compliance:  Environmentally compliant for global manufacturing requirements.

Why Choose 5SGXMA5N3F40I3N?

The 5SGXMA5N3F40I3N provides a combination of substantial programmable logic, significant on-chip memory, and large I/O capacity in a compact FCBGA package suited for industrial environments. Its defined operating voltage and temperature range make it appropriate for designs that demand predictable electrical characteristics and wide thermal tolerance.

This device is a fit for engineering teams building high-density FPGA-based subsystems that must consolidate functionality, minimize external components, and meet industrial operating requirements while leveraging the Stratix V GX family characteristics documented in the device datasheet.

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