5SGXMA5N3F40I3WN

The 5SGXMA5N3F40I3WN is a Stratix V GX family FPGA manufactured by Intel, delivered in a 1517‑BBGA FCBGA package for surface-mount assembly. It combines very high logic capacity, substantial on‑chip memory, and a large I/O complement targeted at complex digital system integration.

As an industrial‑grade device (–40 °C to 100 °C), this Stratix V GX part is specified with a low-voltage core supply range and is covered by the Stratix V device documentation that details electrical and switching characteristics, including I/O timing and transceiver speed grade options for the family.

Key Features

• Core density — 490,000 logic elements for implementing large-scale custom logic and system functions.
• Embedded memory — Approximately 46 Mbits of on‑chip RAM to support buffering, packet processing, and state storage without external memory.
• I/O capacity — 600 user I/O pins to interface with high-pin-count peripherals, multi-lane PHYs, or complex board-level fabrics.
• Package and mounting — 1517‑BBGA (1517‑FBGA, 40×40) FCBGA package designed for surface‑mount applications where high ball count and routing density are required.
• Power and core supply — Core voltage supply specified from 820 mV to 880 mV for the device core domain.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for demanding thermal environments.
• Compliance — RoHS compliant.
• Stratix V family reference — Device is part of the Stratix V GX series; family documentation includes detailed electrical, switching, and transceiver characteristics.

Typical Applications

• High‑density logic integration — Implement complex, large-scale digital designs that require hundreds of thousands of logic elements and substantial embedded RAM.
• High‑pin-count system interfaces — Consolidate multiple peripheral interfaces or multi-lane connectivity using the device’s 600 I/Os.
• Industrial and embedded systems — Deploy in systems requiring industrial temperature operation (−40 °C to 100 °C) and RoHS compliance.

Unique Advantages

• Large programmable fabric — 490,000 logic elements reduce the need for additional discrete logic, simplifying board design and lowering BOM complexity.
• Substantial embedded memory — Approximately 46 Mbits of on‑chip RAM supports data buffering and local storage without immediate reliance on external memory subsystems.
• Extensive I/O — 600 I/Os enable dense connectivity to sensors, PHYs, FPGAs, or custom mezzanine interfaces.
• Industrial temperature rating — −40 °C to 100 °C operating range extends deployment options to harsher environments.
• High‑density package — 1517‑BBGA FCBGA footprint provides a high-ball-count solution for complex signal routing in compact board layouts.
• Documented family characteristics — Stratix V device documentation provides detailed electrical and switching characteristics to support design validation and system integration.

Why Choose 5SGXMA5N3F40I3WN?

The 5SGXMA5N3F40I3WN delivers a combination of very high logic capacity, significant on‑chip RAM, and a large I/O count in a high-density FCBGA package, making it appropriate for designs that consolidate complex digital functions and dense external interfacing. Its industrial temperature rating and RoHS compliance make it suitable for applications that require extended environmental tolerance.

As a member of the Intel Stratix V GX family, this device is supported by comprehensive device documentation that covers electrical characteristics, I/O timing, and family transceiver options—helping engineering teams evaluate system-level tradeoffs and scale designs within the Stratix V portfolio.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA5N3F40I3WN and to discuss how this Stratix V GX FPGA can fit your project requirements.