5SGXMA5N3F40I4WN

The 5SGXMA5N3F40I4WN is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in an industrial temperature grade. It delivers high logic capacity and substantial on-chip memory in a 1517-BBGA FCBGA package for surface-mount applications.

Key attributes include approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, up to 600 I/O pins, and a low-voltage core supply range. The device is RoHS compliant and specified for operation from –40 °C to 100 °C.

Key Features

• High-density programmable logic — Approximately 490,000 logic elements for complex, large-scale designs.
• On-chip embedded memory — Approximately 46 Mbits of embedded memory to support buffering, lookup tables, and data-path storage.
• Rich I/O capability — Up to 600 I/O pins to accommodate extensive peripheral and interface requirements.
• Low-voltage core supply — Core voltage specified from 820 mV to 880 mV.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C.
• Package and mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40) and surface-mount mounting type.
• Series-level transceiver options — Stratix V GX family documentation lists GX transceiver speed grades including channels up to 14.1 Gbps at the series level.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density FPGA implementations — Leverage ~490,000 logic elements and ~46 Mbits of embedded memory for complex, logic- and memory-intensive designs.
• High I/O systems — Use the device’s up to 600 I/O pins to interface with multiple peripherals, sensors, and external subsystems.
• Industrial-grade electronics — Industrial temperature rating (–40 °C to 100 °C) supports deployment in temperature-challenging environments.
• High-speed serial designs (series-level) — Stratix V GX family documentation includes transceiver speed grades up to 14.1 Gbps, supporting designs that require high-speed serial channels.

Unique Advantages

• Highly integrated logic and memory — Combines a large logic element count with approximately 46 Mbits of embedded RAM to reduce external memory requirements.
• Extensive I/O — 600 I/O pins allow flexible system partitioning and rich peripheral connectivity without additional interface chips.
• Industrial robustness — Specified operating range from –40 °C to 100 °C for reliable operation in industrial environments.
• Low-voltage core operation — 820–880 mV core supply facilitates designs targeting low-voltage FPGA cores.
• High-density FCBGA packaging — 1517-BBGA package enables compact, surface-mount system implementations.
• Regulatory compliance — RoHS compliant to support environmentally constrained designs.

Why Choose 5SGXMA5N3F40I4WN?

The 5SGXMA5N3F40I4WN positions itself where large FPGA logic capacity, significant on-chip memory, and broad I/O count are required within an industrial temperature envelope. Its Stratix V GX lineage and documented series-level transceiver options make it suitable for demanding designs that need high integration and predictable thermal performance.

This device is appropriate for engineering teams building complex, high-density systems that require a compact FCBGA package, low-voltage core operation, and RoHS compliance. The available datasheet and Intel’s Stratix V family documentation provide detailed electrical and switching specifications to support design and validation activities.

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