5SGXMA5N3F45C2LN

The 5SGXMA5N3F45C2LN is a Stratix V GX family field-programmable gate array from Intel, delivered in a 1932-BBGA FCBGA package for surface-mount applications. This commercial-grade FPGA combines high logic density, substantial on-chip memory, and a large I/O complement to support complex, board-level programmable logic designs.

Key electrical and mechanical attributes include a supply voltage range of 820 mV to 880 mV, an operating temperature range of 0 °C to 85 °C, and RoHS compliance.

Key Features

• High logic capacity — 490,000 logic elements (cells) to implement large-scale programmable logic and complex functions on a single device.
• Significant embedded memory — Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
• Extensive I/O — 840 general-purpose I/O pins for broad interface connectivity and high pin-count designs.
• Commercial temperature grade — Rated to operate from 0 °C to 85 °C for standard commercial applications.
• Low-voltage core operation — Core supply specified from 820 mV to 880 mV to match system power domains and vendor power recommendations.
• Package and mounting — 1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), designed for surface-mount assembly.
• Regulatory and environmental — RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• High-density programmable logic — Use the large logic element count for complex state machines, data-path logic, and custom processing pipelines.
• Memory-intensive designs — Take advantage of approximately 46 Mbits of embedded RAM for buffering, packet storage, and on-chip data handling.
• I/O aggregation and bridging — 840 I/O pins enable wide parallel interfaces, protocol bridging, and multi-channel aggregation on a single device.
• Commercial embedded systems — Commercial temperature rating and surface-mount BGA package suit a range of board-level embedded and systems applications.

Unique Advantages

• Highly integrated logic and memory: 490,000 logic elements combined with approximately 46 Mbits of on-chip RAM reduce the need for external resources and simplify board design.
• Large I/O footprint: 840 I/O pins provide design flexibility for multi-interface systems and high channel-count applications.
• Compact BGA footprint: 1932-BBGA FCBGA packaging allows dense PCB routing while supporting surface-mount assembly processes.
• Predictable commercial operation: Rated 0 °C to 85 °C to match standard commercial deployment and qualification flows.
• Low-voltage core compatibility: 820 mV–880 mV supply range aligns with modern low-voltage FPGA core domains for power-managed systems.
• RoHS compliant: Meets environmental requirements for reduced hazardous substances in production assemblies.

Why Choose 5SGXMA5N3F45C2LN?

The 5SGXMA5N3F45C2LN delivers a balance of high logic density, substantial embedded memory, and broad I/O capacity in a commercial-grade Stratix V GX package. Its specifications make it suitable for designers who need to consolidate complex logic, memory buffering, and multi-channel interfacing into a single FPGA solution while maintaining standard commercial temperature operation.

This device is appropriate for development teams and procurement organizations targeting scalable, board-level programmable solutions that leverage the Stratix V GX family’s characteristics in a 1932-BBGA surface-mount package with RoHS compliance.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the 5SGXMA5N3F45C2LN.