5SGXMA5N3F45C2WN

The 5SGXMA5N3F45C2WN is a Stratix V GX FPGA from Intel, offered in a 1932-ball FCBGA package for surface-mount assembly. This device provides a large programmable fabric with extensive on-chip memory and a high I/O count for complex, high-density designs.

Key attributes of this part include 490,000 logic elements, approximately 46 Mbits of embedded RAM, and 840 I/Os, making it suitable for applications that require substantial logic capacity, memory buffering, and rich external connectivity within a commercial temperature grade.

Key Features

• Logic Capacity  490,000 logic elements to support large, complex FPGA implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, state storage, and data processing.
• I/O Resources  840 I/O pins to enable wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device.
• Power Supply  Core supply voltage range: 870 mV to 930 mV.
• Operating Range & Grade  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant for environmental compliance in commercial assemblies.
• Stratix V GX Family  Part of the Stratix V device family; refer to the Stratix V device documentation for series-level electrical and transceiver characteristics.

Typical Applications

• High-density FPGA designs  Use the large logic element count and embedded RAM to implement complex algorithms and large programmable subsystems.
• Multi-interface bridging  High I/O count enables broad connectivity for bridging between multiple parallel and serial interfaces without excessive external glue logic.
• Data buffering and packet processing  On-chip memory capacity supports sizable buffering and stateful processing in data-path and packet-handling designs.

Unique Advantages

• Extensive programmable capacity: 490,000 logic elements provide headroom for large designs and IP integration.
• Substantial embedded memory: Approximately 46 Mbits of RAM reduces dependence on external memory for many buffering and caching needs.
• High I/O availability: 840 I/Os simplify system integration and reduce the need for external multiplexing.
• Compact high-pin-count package: 1932-ball FCBGA (45×45) supports dense pin routing for complex board-level designs.
• Low-voltage core operation: 0.87–0.93 V supply range supports modern power-optimized architectures.
• Commercial-grade deployment: Rated for 0 °C to 85 °C for standard commercial applications.

Why Choose 5SGXMA5N3F45C2WN?

The 5SGXMA5N3F45C2WN combines a high logic element count, significant on-chip RAM, and a very large I/O complement in a single surface-mount FCBGA package, offering a compact platform for dense, memory-intensive programmable designs. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard commercial systems.

This device is well suited to engineers and design teams building large FPGA-based subsystems that require integrated memory, high connectivity, and a proven Stratix V device family foundation. For designs that demand scalability within a commercial-grade FPGA platform, this part delivers the capacity and I/O necessary to consolidate functionality and reduce external component count.

If you would like pricing, availability, or a formal quote for 5SGXMA5N3F45C2WN, submit a request to receive a quote and obtain ordering information.