5SGXMA5N3F45C2N

The 5SGXMA5N3F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. This device delivers very large logic capacity and on-chip memory combined with a high I/O count in a 1932-ball FCBGA package.

Key attributes include 490,000 logic elements, approximately 46 Mbits of embedded memory, 185,000 LABs, and 840 user I/Os—making it suitable for designs that require extensive programmable logic, large embedded RAM, and rich external interfacing within a commercial temperature range.

Key Features

• Core Logic  490,000 logic elements and 185,000 LABs provide extensive programmable fabric for complex logic implementation.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffering, state storage, and data-processing functions.
• I/O Density  840 user I/Os for rich peripheral and high-pin-count interfacing.
• Power Supply  Supported core voltage range of 870 mV to 930 mV for core power rails.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45 × 45), designed for surface-mount assembly.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.
• Documentation  Electrical and switching characteristics (including I/O timing and transceiver specifications) are covered in the device datasheet.

Typical Applications

• High-speed communications and networking  Rich I/O and large logic/memory resources support protocol implementation and packet processing.
• Data center and telecom infrastructure  Large on-chip RAM and programmable fabric enable complex data-path acceleration and buffering.
• Signal processing and compute acceleration  High logic element count and embedded memory support implementation of algorithms and custom accelerators.
• I/O‑intensive systems  840 I/Os accommodate dense external interfaces and multi-channel connectivity.

Unique Advantages

• Massive programmable capacity: 490,000 logic elements and 185,000 LABs enable large, feature-rich FPGA designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces external memory dependence for buffering and state storage.
• Extensive external connectivity: 840 I/Os provide flexibility for complex interfacing, multiple peripherals, and multi-channel systems.
• Compact, manufacturable package: 1932-ball FCBGA in a 45 × 45 supplier footprint suits surface-mount assembly for high-density boards.
• Design-grade electrical data: Device datasheet includes detailed electrical and switching characteristics to support robust power and timing design.
• RoHS compliant: Aligned with environmental compliance requirements for lead-free manufacturing.

Why Choose 5SGXMA5N3F45C2N?

The 5SGXMA5N3F45C2N Stratix V GX FPGA positions itself as a high-capacity programmable platform combining hundreds of thousands of logic elements, tens of megabits of embedded memory, and a very high I/O count in a 1932-ball FCBGA package. Its electrical characteristics and documented switching behavior help engineers design for performance, timing, and power within a commercial temperature range.

This device is well suited for teams developing complex, I/O-heavy systems that require significant on-chip resources and well-documented electrical specs to drive board- and system-level design decisions.

Request a quote or submit a pricing inquiry to start your evaluation and obtain availability and lead-time information for 5SGXMA5N3F45C2N.