5SGXMA5N3F45C2G

The 5SGXMA5N3F45C2G is an Intel Stratix V GX field programmable gate array (FPGA) in a high‑density FCBGA package. It delivers large on‑chip logic and embedded memory combined with an extensive I/O complement for designs that require significant integration density and connectivity.

Offered as a commercial‑grade Stratix V GX device, it targets high‑density digital designs where large logic capacity, substantial embedded RAM, and high I/O count are primary requirements. Detailed electrical and switching characteristics for the Stratix V family are published in the device datasheet.

Key Features

• Logic Capacity  Approximately 490,000 logic elements for implementing large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and embedded data structures without heavy external memory dependence.
• I/O Density  840 user I/O pins to support wide parallel interfaces, multi‑lane connectivity, and extensive peripheral integration.
• Package & Mounting  1932‑BBGA (FCBGA) package; supplier package listed as 1932‑FBGA, FC (45 × 45). Surface mount form factor suitable for compact, high‑density PCBs.
• Power  Core voltage supply range specified at 870 mV to 930 mV, enabling integration into designs with controlled low‑voltage core rails.
• Temperature & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.
• Family Transceiver Capability (Stratix V GX)  As a Stratix V GX family device, the family supports high‑speed transceiver options and detailed transceiver and I/O timing characteristics are provided in the Stratix V device datasheet.

Typical Applications

• High‑density digital systems  Large logic capacity and embedded RAM enable consolidation of complex logic functions and custom accelerators into a single device.
• High‑bandwidth interfaces and protocol bridging  840 I/Os and Stratix V GX transceiver capabilities support multi‑lane and wide parallel connectivity requirements.
• Prototyping and system integration  High logic element count and ample memory make the device suitable for hardware prototyping and integration of multiple subsystems on one FPGA.

Unique Advantages

• High integration density: With ~490k logic elements and ~46 Mbits of embedded memory, the device enables large designs to run on a single FPGA, reducing board-level complexity.
• Extensive I/O count: 840 user I/Os allow broad peripheral and interface support without external multiplexing, simplifying board routing and system partitioning.
• Compact FCBGA footprint: The 1932‑ball FCBGA package delivers high pin count in a compact 45 × 45 package outline for space-constrained applications.
• Low core voltage support: Core supply range of 870–930 mV aligns the device with modern low‑voltage power rails for efficient system power design.
• Commercial grade and RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) and compliant with RoHS requirements for regulatory and manufacturing compatibility.

Why Choose 5SGXMA5N3F45C2G?

The 5SGXMA5N3F45C2G combines substantial logic capacity, significant on‑chip memory, and a high I/O count in a single Stratix V GX FCBGA package, making it well suited to designs that demand consolidation of complex digital functions and wide connectivity. Its commercial temperature rating and RoHS compliance support standard production environments.

For engineers and system designers prioritizing integration density and rich I/O resources, this Stratix V GX device provides a platform that scales with complex logic requirements while maintaining compact board footprint and controlled core voltage operation. Refer to the Stratix V device datasheet for detailed electrical, switching, and transceiver specifications to align the device with your system requirements.

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