5SGXMA7K1F40I2G

The 5SGXMA7K1F40I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC optimized for high-density programmable logic applications. It provides a large on-chip programmable fabric with substantial embedded memory, a high I/O count, and industrial-grade operating range for designs that require extended temperature tolerance and robust integration.

This device targets designs that need significant logic resources, abundant I/O, and a low-voltage core operating window, enabling compact, high-functionality implementations in industrial and communications-focused equipment.

Key Features

• High-density logic — 622,000 logic elements (cells) to implement complex digital designs and large-scale FPGA functions.
• Embedded memory — approximately 51.2 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage for performance-critical designs.
• Rich I/O — 696 I/O pins to accommodate complex board-level interfaces and high pin-count system integration.
• Power and core voltage — core voltage supply range of 870 mV to 930 mV for low-voltage core operation.
• Industrial temperature grade — specified operating temperature from −40 °C to 100 °C for deployments in industrial environments.
• Package and mounting — 1517-BBGA (FCBGA) package, supplier package listed as 1517-FBGA (40×40), surface-mount mounting for high-density PCB integration.
• Compliance — RoHS-compliant manufacturing to meet environmental and regulatory requirements.

Typical Applications

• High-density digital systems — Implement complex logic, custom accelerators, and protocol handling using the device’s large logic element count and embedded memory.
• Communications and networking equipment — Leverage the high I/O count and large programmable fabric for packet processing, protocol bridging, and interface aggregation.
• Industrial control and automation — Use industrial temperature range and abundant I/O for reliable control, signal aggregation, and real-time processing in industrial environments.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and interfaces.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering and on-chip acceleration without extensive external memory.
• High I/O density: 696 I/Os provide flexibility to connect to numerous peripherals, transceivers, and system interfaces directly at the FPGA.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C for deployments where extended temperature tolerance is required.
• Compact, surface-mount packaging: 1517-BBGA FCBGA package supports high-density PCB designs while maintaining robust mechanical and thermal characteristics.
• Environmentally compliant: RoHS status ensures the device meets common environmental compliance needs.

Why Choose 5SGXMA7K1F40I2G?

The 5SGXMA7K1F40I2G delivers a balance of extensive logic resources, substantial embedded memory, and a high I/O count in a single, industrial-grade FCBGA package. Its low-voltage core operating window and surface-mount BBGA footprint enable compact, power-aware designs while supporting demanding integration requirements.

This device is well suited to engineering teams building complex digital systems, communications equipment, or industrial control platforms that require on-chip capacity for logic and memory, high interface density, and reliable operation across an extended temperature range.

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