5SGXMA7K2F35C1N

The 5SGXMA7K2F35C1N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic density, substantial on‑chip RAM, and a large I/O count in a 1152‑FBGA (35×35) surface‑mount package for commercial‑grade applications.

Engineered for designs that require dense programmable logic and significant embedded memory while operating within a commercial temperature range, this device targets complex digital, signal‑processing and connectivity functions where integration and board‑level I/O capacity matter.

Key Features

• Core Logic  622,000 logic elements (cells) provide high programmable logic density for complex algorithms and parallel processing.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support large buffering, lookup tables, and state storage.
• I/O Capability  432 user I/Os for broad board‑level interfacing and dense connectivity to peripherals and external devices.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35) designed for surface‑mount assembly.
• Power  Specified voltage supply range of 870 mV to 930 mV to meet the device’s operating requirements.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for lead‑free and restricted‑materials requirements.
• Stratix V GX Series Characteristics  Part of the Stratix V GX family; series documentation covers transceiver specifications, core and periphery performance, and I/O timing for designs using Stratix V GX devices.

Typical Applications

• High‑density digital processing  Use the device’s 622,000 logic elements and large embedded RAM to implement complex DSP pipelines, packet processing, and compute‑heavy algorithms.
• Board‑level interface hubs  432 I/Os enable hub and bridge functions between multiple high‑pin‑count peripherals and backplane connections.
• Communication and connectivity subsystems  As a Stratix V GX device, it is suitable where series transceiver capabilities and abundant I/O are required for building high‑speed serial interfaces and protocol bridging at the board level.

Unique Advantages

• High logic density: 622,000 logic elements enable integration of large, multi‑functional designs into a single FPGA, reducing system BOM.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports buffering, packet queues, and lookup tables without immediate reliance on external memory.
• Large I/O complement: 432 I/Os provide flexibility for multi‑lane interfaces, GPIO, and parallel buses directly from the FPGA package.
• Space‑efficient packaging: 1152‑FBGA (35×35) package delivers high pin density in a compact surface‑mount form factor suitable for modern PCB layouts.
• Commercial operating range: Rated for 0 °C to 85 °C operation to match commercial‑grade system requirements.
• Regulatory readiness: RoHS compliance supports deployment in regions and assemblies that require restricted‑substance adherence.

Why Choose 5SGXMA7K2F35C1N?

The 5SGXMA7K2F35C1N positions itself as a high‑capacity, commercially rated Stratix V GX FPGA that brings together dense programmable logic, sizable embedded RAM, and a broad I/O footprint in a 1152‑FBGA package. It is well suited to engineering teams designing complex digital systems that prioritize integration and on‑chip resources to reduce external components.

With Intel’s Stratix V GX family documentation available for series‑level electrical and transceiver characteristics, designers gain access to detailed device behavior for system integration, helping support scalable designs that leverage the FPGA’s programmable capabilities over product development cycles.

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