5SGXMA7K2F35C2G

The 5SGXMA7K2F35C2G is an Intel Stratix V GX field programmable gate array (FPGA) offered in a 1152-ball FBGA package. It delivers high logic density, large embedded memory, and a substantial I/O count for complex, transceiver-capable system designs.

As a member of the Stratix V GX family, this device targets high-density digital designs and transceiver-enabled applications that require extensive on-chip memory, many I/Os, and commercial temperature operation.

Key Features

• Core logic — 622,000 logic elements organized across 234,720 logic array blocks, enabling implementation of large, compute-intensive designs.
• Embedded memory — Approximately 51.2 Mbits of total on-chip RAM for buffering, large FIFOs, and local data storage.
• I/O capacity — 432 programmable I/O pins to support dense board-level connectivity and multiple external interfaces.
• Transceiver family capability (series-level) — Stratix V GX devices include transceiver speed grades on the series level; refer to the Stratix V GX series documentation for available transceiver options.
• Power and supply — Core voltage supply specified at 870–930 mV to match system power design targets.
• Package and mounting — 1152-FBGA (35×35) supplier device package; surface-mount device in an FCBGA form factor.
• Commercial grade and operating range — Commercial temperature grade with an operating range of 0°C to 85°C.
• Compliance — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-speed serial communications — Use the Stratix V GX series transceiver capability and the device's high I/O count for line interfaces and packet processing.
• Complex digital systems — Large logic capacity and abundant embedded memory support multi-function FPGA designs and hardware acceleration tasks.
• Data buffering and packet buffering — Approximately 51.2 Mbits of on-chip RAM is suitable for large FIFOs and intermediate data storage in throughput-oriented systems.
• Dense I/O integration — 432 I/Os allow consolidation of multiple peripheral interfaces and board-level signals into a single FPGA solution.

Unique Advantages

• High logic density: 622,000 logic elements accommodate complex state machines, datapaths, and custom accelerators.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM reduces external memory dependence for many buffering and caching requirements.
• Strong I/O capability: 432 I/Os enable broad right-size integration for multi-interface designs.
• Compact FCBGA package: 1152-ball FBGA (35×35) provides a high-pin-count solution in a surface-mount form factor for space-constrained boards.
• Commercial temperature rating: 0°C to 85°C operation fits standard commercial applications and environments.
• RoHS compliant: Meets lead-free manufacturing requirements.

Why Choose 5SGXMA7K2F35C2G?

The 5SGXMA7K2F35C2G combines very high logic capacity, significant embedded memory, and a large I/O complement in a 1152-FBGA package, making it well suited for designers building dense, transceiver-enabled FPGA systems on a commercial temperature footprint. As part of the Intel Stratix V GX family, the device benefits from series-level documentation and device-characteristic definitions that support system-level planning and integration.

Choose this device for designs that require large on-chip resources, broad connectivity, and established series-level transceiver capabilities while operating within commercial temperature ranges.

Request a quote or submit an RFQ to obtain pricing and availability for the 5SGXMA7K2F35C2G.