5SGXMA7K2F35C2WN

The 5SGXMA7K2F35C2WN is a Stratix V GX field programmable gate array (FPGA) IC from Intel, offered in a commercial temperature grade. This high-density FPGA delivers 622,000 logic elements and approximately 51.2 Mbits of embedded memory, with 432 user I/Os in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package. The device is targeted at designs that require large programmable logic capacity, significant on-chip RAM, and extensive I/O integration while operating from a low-voltage core supply.

Key Features

• High Logic Density  622,000 logic elements suitable for complex, large-scale digital designs and system integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• Extensive I/O  432 I/O pins to support wide parallel interfaces, multiple peripherals, and high pin-count interconnects.
• Package and Mounting  1152-BBGA (supplier package: 1152-FBGA 35×35) in a surface-mount FCBGA format for high-density PCB assemblies.
• Power and Core Supply  Core voltage range from 870 mV to 930 mV, enabling integration into low-voltage power domains.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, appropriate for commercial and controlled-environment applications.
• Standards Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density logic integration  Implement complex, multi-function digital logic and custom processing pipelines where large logic element counts and embedded memory are required.
• Data buffering and packet handling  Use the substantial on-chip RAM and abundant I/O to implement buffering, packet staging, and wide-interface data paths.
• High-pin-count system controllers  Leverage 432 I/Os and the 1152-BBGA package for board-level controllers that require many peripheral connections and high pin density.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and memory-intensive algorithms without external memory overhead.
• High I/O availability: 432 I/Os provide flexibility for parallel interfaces, multiple peripherals, and wide data buses.
• Compact, high-density package: 1152-BBGA (35×35) surface-mount package enables dense PCB layouts while supporting the device’s I/O and power needs.
• Low-voltage core operation: 870 mV–930 mV supply range aligns with modern low-voltage power rails for efficient system integration.
• Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose 5SGXMA7K2F35C2WN?

The 5SGXMA7K2F35C2WN combines very high logic capacity, substantial embedded RAM, and broad I/O count in a compact 1152-BBGA package, making it well-suited to complex commercial FPGA designs that demand integration and density. Its low-voltage core and commercial operating range enable straightforward integration into modern system power domains and environments.

As a member of the Stratix V GX family, this device is positioned for advanced designs that require a balance of logic resources, on-chip memory, and I/O bandwidth, delivering long-term value through consolidation of functions and reduced external component needs.

Request a quote or submit an inquiry to initiate procurement and evaluate 5SGXMA7K2F35C2WN for your next high-density FPGA design.