5SGXMA7K2F35C3N

The 5SGXMA7K2F35C3N is a Stratix® V GX field programmable gate array (FPGA) offered in a 1152‑BBGA FCBGA package. This commercial‑grade FPGA provides very high logic capacity, a large pool of embedded RAM, and extensive I/O to support complex, high‑density programmable designs.

Engineered for designs that require significant on‑chip logic and memory resources with a compact surface‑mount package, this device is suited to applications that need substantial integration of custom digital functions and multiple external interfaces while operating within a commercial temperature range.

Key Features

• Logic Capacity  622,000 logic elements for implementing large, complex digital designs and parallel processing architectures.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support buffering, look‑up tables, and large data structures within the FPGA fabric.
• I/O Count  432 user I/O pins, providing broad connectivity for interfaces, memory buses, and peripheral devices.
• Package & Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount package suitable for compact board designs.
• Power Supply  Core supply operating range of 0.820 V to 0.880 V, enabling low‑voltage core operation in supported system power architectures.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant to meet standard environmental requirements for lead‑free assembly.

Typical Applications

• High‑density digital processing  Implement large custom datapaths, signal processing pipelines, and parallel compute engines using the device’s extensive logic and embedded RAM.
• Network and communications equipment  Use the abundant I/O and logic resources to integrate multiple protocol interfaces, packet processing, or custom switching functions.
• Custom compute acceleration  Deploy hardware accelerators and offload tasks from general‑purpose processors where large on‑chip memory and logic are required.
• Prototyping and system integration  Leverage the high logic element count and I/O capacity to prototype complex systems and consolidate multiple functions into a single FPGA package.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded memory reduce the need for external ASICs or multiple FPGAs.
• Extensive external connectivity: 432 I/Os allow flexible interfacing to external devices, memories, and board‑level subsystems without extensive multiplexing.
• Compact surface‑mount package: 1152‑BBGA (35×35 supplier footprint) balances high pin count with a board‑space efficient form factor.
• Commercial temperature operation: Rated 0 °C to 85 °C for reliable performance in commercial enterprise and lab environments.
• Environmentally compliant: RoHS compliance supports lead‑free manufacturing processes and environmental requirements.

Why Choose 5SGXMA7K2F35C3N?

This Stratix® V GX FPGA targets designs that demand very large programmable logic capacity, substantial embedded memory, and a high number of I/Os in a single surface‑mount package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on‑chip RAM, and 432 I/Os makes it well suited for integrating multiple high‑complexity functions into compact commercial systems.

Choose the 5SGXMA7K2F35C3N when your project requires scalability within the Stratix V family, a robust on‑chip resource set for advanced digital implementations, and RoHS‑compliant packaging for standard manufacturing flows.

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