5SGXMA7K2F35C3

The 5SGXMA7K2F35C3 is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable-logic solution with 622,000 logic elements and approximately 51.2 Mbits of embedded memory for complex digital designs.

With 432 user I/Os, a compact 1152-BBGA (35×35) FCBGA package and a controlled supply range of 820 mV to 880 mV, this commercial-grade device is intended for designs that require substantial on-chip resources and multi‑I/O connectivity within a surface-mount form factor.

Key Features

• Logic Capacity 622,000 logic elements (cells) to implement large-scale programmable logic designs.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic functions.
• I/O 432 user I/O pins to support broad interfacing and system integration requirements.
• Package & Mounting 1152-BBGA (FCBGA), supplier package 1152-FBGA (35×35); surface-mount mounting for compact board integration.
• Power Core voltage supply range of 820 mV to 880 mV to match system power-rail constraints.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for environmental and assembly considerations.

Typical Applications

• High-density compute and processing Use the large logic and memory resources to implement complex signal processing, packet processing, or custom compute pipelines.
• Memory-intensive logic On-chip RAM supports buffering, large FIFOs, and state machines for dataflow and streaming applications.
• Multi-I/O systems High I/O count enables aggregation of multiple peripherals, interfaces, and parallel data paths on a single device.

Unique Advantages

• High logic integration: 622,000 logic elements reduce the need for multi-device partitioning and simplify system architecture.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes external memory requirements and lowers system BOM complexity.
• Generous I/O capability: 432 I/Os provide flexibility for dense interconnects, multiple interfaces, and parallel data channels.
• Compact, board-ready package: 1152-BBGA (35×35) surface-mount package supports high-density PCB layouts while keeping overall board area efficient.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic applications.
• Regulatory compatibility: RoHS compliance supports lead-free assembly and environmental requirements.

Why Choose 5SGXMA7K2F35C3?

The 5SGXMA7K2F35C3 delivers a combination of high logic density, substantial embedded memory and extensive I/O in a compact 1152-BBGA surface-mount package. It is positioned for designers who need on-chip resources to consolidate functions, reduce external components, and streamline board-level integration in commercial applications.

With explicit electrical and switching characteristics available in the Stratix V device datasheet, this device supports informed design decisions around power, timing and I/O for projects that require scalable programmable logic and significant on-chip memory capacity.

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