5SGXMA7K2F35I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 750 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7K2F35I2G – Stratix® V GX FPGA, 622,000 logic elements, 432 I/O, 1152-BBGA
The 5SGXMA7K2F35I2G is an industrial-grade Stratix V GX field programmable gate array (FPGA) packaged in a 1152-BBGA (FCBGA) footprint. It delivers a very high logic density and substantial embedded memory to support complex, high-channel-count digital designs.
With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 432 user I/O, this device is targeted at designs that require large on-chip resources, extensive I/O connectivity, and operation across an industrial temperature range.
Key Features
- Core Logic 622,000 logic elements provide high-density programmable logic resources for large-scale digital designs and complex combinational/sequential logic implementations.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and data storage without relying on external memory.
- I/O Capacity 432 user I/O pins to support wide parallel interfaces, multiple peripheral connections, and complex board-level routing.
- Package 1152-BBGA (FCBGA) supplier device package (1152-FBGA, 35×35) for high pin-count surface-mount integration.
- Power Core voltage supply range from 870 mV to 930 mV to match system power-rail planning and low-voltage FPGA core domains.
- Temperature and Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
- Mounting Surface mount device suitable for modern PCB assembly processes.
- Compliance RoHS-compliant to meet common environmental and manufacturing requirements.
Typical Applications
- High-density digital processing Use the large logic element count and embedded memory for compute-heavy FPGA functions and custom accelerators.
- I/O-intensive systems Leverage 432 I/O pins for multi-lane interfaces, wide data buses, and systems requiring many peripheral connections.
- Industrial control and automation Industrial-grade temperature range and robust packaging make this device suitable for control systems and factory automation equipment.
- Embedded memory-centric designs Approximately 51.2 Mbits of on-chip RAM enable buffering and data staging for streaming and packet processing tasks.
Unique Advantages
- High logic density: 622,000 logic elements reduce the need for multiple FPGAs or external processors in complex designs.
- Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM simplifies memory architecture and reduces external memory bandwidth requirements.
- Extensive I/O: 432 I/O pins support broad interfacing options and simplify board-level design for multi-channel systems.
- Industrial capability: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
- Compact high-pin-count package: 1152-BBGA (35×35) enables a dense footprint for complex systems while maintaining surface-mount compatibility.
- Low-voltage core operation: 870 mV–930 mV supply supports modern low-voltage power architectures.
Why Choose 5SGXMA7K2F35I2G?
The 5SGXMA7K2F35I2G positions itself as a high-density, industrial-grade FPGA option within the Stratix V GX family, combining a very large logic resource pool with considerable on-chip memory and broad I/O capability. It is suited for engineers and system designers building resource-intensive, I/O-rich applications that require reliable operation across extended temperature ranges.
Choosing this device delivers long-term design scalability through on-chip resources and a high-pin-count FCBGA package, reducing the need for external components and helping to streamline board-level integration for complex FPGA-based systems.
Request a quote or submit an RFQ to obtain pricing, lead time, and availability for the 5SGXMA7K2F35I2G.

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