5SGXMA7K2F35I2G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 750 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F35I2G – Stratix® V GX FPGA, 622,000 logic elements, 432 I/O, 1152-BBGA

The 5SGXMA7K2F35I2G is an industrial-grade Stratix V GX field programmable gate array (FPGA) packaged in a 1152-BBGA (FCBGA) footprint. It delivers a very high logic density and substantial embedded memory to support complex, high-channel-count digital designs.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 432 user I/O, this device is targeted at designs that require large on-chip resources, extensive I/O connectivity, and operation across an industrial temperature range.

Key Features

  • Core Logic  622,000 logic elements provide high-density programmable logic resources for large-scale digital designs and complex combinational/sequential logic implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and data storage without relying on external memory.
  • I/O Capacity  432 user I/O pins to support wide parallel interfaces, multiple peripheral connections, and complex board-level routing.
  • Package  1152-BBGA (FCBGA) supplier device package (1152-FBGA, 35×35) for high pin-count surface-mount integration.
  • Power  Core voltage supply range from 870 mV to 930 mV to match system power-rail planning and low-voltage FPGA core domains.
  • Temperature and Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
  • Mounting  Surface mount device suitable for modern PCB assembly processes.
  • Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • High-density digital processing  Use the large logic element count and embedded memory for compute-heavy FPGA functions and custom accelerators.
  • I/O-intensive systems  Leverage 432 I/O pins for multi-lane interfaces, wide data buses, and systems requiring many peripheral connections.
  • Industrial control and automation  Industrial-grade temperature range and robust packaging make this device suitable for control systems and factory automation equipment.
  • Embedded memory-centric designs  Approximately 51.2 Mbits of on-chip RAM enable buffering and data staging for streaming and packet processing tasks.

Unique Advantages

  • High logic density: 622,000 logic elements reduce the need for multiple FPGAs or external processors in complex designs.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM simplifies memory architecture and reduces external memory bandwidth requirements.
  • Extensive I/O: 432 I/O pins support broad interfacing options and simplify board-level design for multi-channel systems.
  • Industrial capability: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
  • Compact high-pin-count package: 1152-BBGA (35×35) enables a dense footprint for complex systems while maintaining surface-mount compatibility.
  • Low-voltage core operation: 870 mV–930 mV supply supports modern low-voltage power architectures.

Why Choose 5SGXMA7K2F35I2G?

The 5SGXMA7K2F35I2G positions itself as a high-density, industrial-grade FPGA option within the Stratix V GX family, combining a very large logic resource pool with considerable on-chip memory and broad I/O capability. It is suited for engineers and system designers building resource-intensive, I/O-rich applications that require reliable operation across extended temperature ranges.

Choosing this device delivers long-term design scalability through on-chip resources and a high-pin-count FCBGA package, reducing the need for external components and helping to streamline board-level integration for complex FPGA-based systems.

Request a quote or submit an RFQ to obtain pricing, lead time, and availability for the 5SGXMA7K2F35I2G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up