5SGXMA7K2F35I2LN

The 5SGXMA7K2F35I2LN is a Stratix® V GX FPGA IC from Intel, offering a high-capacity programmable fabric for industrial applications. This device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 432 user I/Os in a 1152-BBGA (FCBGA) surface-mount package.

Engineered for industrial temperature operation, the device delivers a compact, high-density solution where on-chip memory, I/O count, and logic capacity are key design drivers. The specified core supply voltage and package options support integration into controlled-power, high-performance systems.

Key Features

• Logic Capacity  622,000 logic elements for large-scale programmable logic implementation and complex RTL designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory.
• I/O Resources  432 I/O pins to accommodate dense peripheral, transceiver, and system interfaces on a single device.
• Power  Core voltage supply range of 820 mV to 880 mV for defined core power sequencing and system power budgeting.
• Thermal and Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding temperature environments.
• Package & Mounting  1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35) for compact board-level integration.
• Environmental  RoHS compliant.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for multiple devices and simplify board-level design for complex logic functions.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM enable large data buffering and state retention without immediate external memory requirements.
• Extensive I/O availability: 432 I/Os allow direct connectivity to numerous peripherals and high-pin-count interfaces on a single FPGA.
• Industrial temperature capability: Rated from -40 °C to 100 °C to support deployment in temperature-sensitive industrial environments.
• Defined core power window: 820–880 mV supply range supports predictable core power planning and thermal design.
• Compact FCBGA packaging: 1152-ball FCBGA (35×35) offers a balance of pin count and board footprint for dense system designs.

Why Choose 5SGXMA7K2F35I2LN?

The 5SGXMA7K2F35I2LN positions itself as a high-capacity Stratix® V GX FPGA option for designers who require a combination of large logic resources, significant embedded memory, and abundant I/O in an industrial-grade device. Its defined core voltage range and robust operating temperature make it suitable for systems where controlled power behavior and thermal resilience are important.

This Intel Stratix® V GX device is well suited to engineering teams needing a single, integrated FPGA platform to consolidate functions, reduce board-level complexity, and maintain predictable electrical and thermal characteristics across industrial deployments.

Request a quote or submit a parts inquiry to evaluate how the 5SGXMA7K2F35I2LN can meet your design requirements and procurement needs.