5SGXMA7K2F35I3LG

The 5SGXMA7K2F35I3LG is an Intel Stratix V GX series FPGA offering high logic density and extensive I/O in a high-pin-count FCBGA package. It provides a large on-chip memory footprint and is rated for industrial temperature operation, making it suitable for designs that require dense programmable logic, significant embedded RAM, and robust operating range.

This device is part of the Stratix V GX family, which includes devices with high-speed transceiver capability and multiple core/transceiver speed grades as documented in the Stratix V datasheet.

Key Features

• Logic Capacity  Provides 622,000 logic elements for implementing complex digital designs and large FPGA fabrics.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Density  432 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Package  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) for high pin-count board designs and dense routing.
• Power  Core voltage supply specified from 820 mV to 880 mV for the device core.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Mounting  Surface-mount device suited for modern PCB assembly processes.
• RoHS Compliance  Lead-free and RoHS compliant.
• Stratix V GX Family Transceiver Capability  As a Stratix V GX device, the family supports high-speed transceiver options (series documentation lists GX channel rates up to 14.1 Gbps for applicable speed grades).

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM enable complex signal processing, packet processing, and compute-acceleration tasks.
• High-speed serial interfaces  Stratix V GX family transceiver capabilities suit designs requiring high-rate serial links and multi-gigabit channel aggregation.
• I/O-intensive systems  With 432 I/O pins, this FPGA supports boards that need many parallel interfaces, multi-channel ADC/DAC connections, or broad peripheral access.
• Industrial equipment  Industrial temperature rating and robust packaging make it appropriate for industrial control, test equipment, and communications infrastructure equipment.

Unique Advantages

• High programmable density: 622,000 logic elements provide the capacity to consolidate multiple functions into a single device and reduce board-level complexity.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Broad I/O availability: 432 I/O pins simplify integration with multiple peripherals and parallel interfaces without external I/O expanders.
• Industrial-grade operation: −40°C to 100°C operating range supports reliable operation in harsh and temperature-variable environments.
• High pin-count FCBGA package: 1152-ball FBGA (35×35) enables maximum routing density and signal distribution for complex PCB layouts.
• Family-level transceiver options: Stratix V GX family support for multi-gigabit transceivers allows scalable high-speed serial connectivity where needed.

Why Choose 5SGXMA7K2F35I3LG?

The 5SGXMA7K2F35I3LG combines substantial logic resources, significant embedded memory, and abundant I/O in a high-pin-count FCBGA package, targeted at designs that demand high integration and industrial temperature operation. As part of Intel's Stratix V GX family, it aligns with a documented set of transceiver and speed-grade options for projects that may require scalable high-speed serial links.

This device is suited for engineering teams developing high-density digital systems, communication platforms, and industrial equipment where on-chip resources, reliable operation across a wide temperature range, and a compact board footprint are important design drivers.

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