5SGXMA7K2F35I3N

The 5SGXMA7K2F35I3N is a Stratix V GX field-programmable gate array (FPGA) in a 1152‑BBGA FCBGA package, rated for industrial operation. It integrates a high logic capacity and substantial on-chip RAM to support complex digital designs requiring large programmable logic and memory resources.

Typical design targets include high-density embedded logic, large buffering and memory-intensive functions, and applications that require a broad set of user I/Os and industrial temperature operation.

Key Features

• Logic Capacity  Approximately 622,000 logic elements suited for large-scale custom logic and complex datapath implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large FIFOs, buffering, and memory-mapped logic functions.
• User I/Os  432 user I/O pins providing extensive external connectivity for peripherals, board-level interfaces, and multi-channel I/O requirements.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA (35×35)) with surface-mount mounting for high-density board integration.
• Power  Core supply range specified at 820 mV to 880 mV for system power planning and regulator selection.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C to meet elevated ambient and industrial environment requirements.
• Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Networking & Communications  Deploys programmable logic and abundant I/O for custom packet processing, protocol bridging, and interface aggregation in communication equipment.
• High‑Performance Embedded Systems  Supports compute- and memory-intensive accelerator functions where large logic capacity and on-chip RAM are required.
• Industrial Automation  Industrial temperature rating and extensive I/O make it suitable for control systems, motion control, and real-time data aggregation in industrial environments.
• Video & Signal Processing  Large logic and memory resources enable implementation of multi-channel video pipelines, image processing, and DSP-centric datapaths.

Unique Advantages

• High Logic Density: 622,000 logic elements enable complex state machines, deep pipelines, and wide datapaths within a single device.
• Substantial Embedded Memory: Approximately 51.2 Mbits of on-chip RAM reduces external memory dependency for buffering and local storage.
• Large I/O Count: 432 user I/Os simplify board routing and reduce the need for external serializers or multiplexers in multi‑interface designs.
• Industrial Robustness: Rated for −40°C to 100°C operation, supporting deployments in demanding temperature environments.
• Compact, High‑Density Package: 1152‑BBGA FCBGA (35×35) enables dense PCB layouts while preserving extensive connectivity.
• Regulatory Compatibility: RoHS compliance supports manufacturing and environmental requirements.

Why Choose 5SGXMA7K2F35I3N?

The 5SGXMA7K2F35I3N combines high programmable logic capacity, significant embedded memory, and a large I/O complement in an industrial‑rated Stratix V GX device package. Its power and thermal characteristics, along with RoHS compliance and surface-mount 1152‑BBGA packaging, make it well suited for engineers designing complex, memory‑intensive systems that must operate reliably across a wide temperature range.

This device is appropriate for development teams and systems integrators targeting high-density FPGA implementations that require scalability, extensive I/O, and on-chip memory to reduce external components and simplify board-level design.

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