5SGXMA7K2F35I2WN

The 5SGXMA7K2F35I2WN is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It combines high logic capacity and substantial on-chip memory with a large I/O complement and an FCBGA package to address demanding, high-density digital designs.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this device is targeted at designs that require extensive programmable logic, abundant embedded RAM, and many external interfaces while operating across an industrial temperature range.

Key Features

• High Logic Density  622,000 logic elements provide extensive programmable resources for large-scale logic, DSP, and protocol implementations.
• Substantial Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet memory, FIFOs, and other memory-intensive functions.
• Large I/O Count  432 user I/Os enable high channel counts and flexible interfacing to peripherals, sensors, and high-pin-count backplanes.
• Industrial Temperature Grade  Rated for operation from –40°C to 100°C for deployment in industrial environments and temperature-challenging applications.
• Core Voltage Range  Specified core voltage supply between 870 mV and 930 mV to define power domain requirements for system design.
• High-density Package  1152-BBGA (FCBGA) supplier package, 1152-FBGA (35×35), optimized for surface-mount PCB implementation where dense routing and compact footprint are required.
• Series-level Transceiver Capability  As a Stratix V GX family device, the series supports GX transceiver channel speed grades (series documentation lists GX channel rates up to 14.1 Gbps depending on speed grade).
• Surface Mount  Designed for standard surface-mount assembly processes to integrate into modern board designs.

Typical Applications

• Industrial Control and Automation  High logic capacity and industrial temperature rating suit complex control systems and real-time processing in factory and process automation equipment.
• High-density I/O Systems  Large I/O count enables multi-channel data aggregation, sensor hubs, and multi-protocol interface designs.
• Memory-Intensive Logic  Significant embedded RAM supports buffering, packet handling, and streaming data applications that require on-chip storage.

Unique Advantages

• Extensive Programmable Resources:  622,000 logic elements reduce reliance on external glue logic and enable integration of complex algorithms on a single device.
• On-chip Memory for Throughput Efficiency:  Approximately 51.2 Mbits of embedded RAM minimizes off-chip traffic and simplifies memory architecture for high-throughput designs.
• High I/O Flexibility:  432 I/Os allow direct connection to many peripherals and parallel interfaces, reducing the need for additional interface chips.
• Industrial-ready Operation:  Rated –40°C to 100°C to maintain operation in harsh or temperature-variable environments common to industrial deployments.
• Compact, High-pin-count Package:  1152-BBGA FCBGA package delivers dense routing and high signal count in a compact footprint for space-constrained boards.

Why Choose 5SGXMA7K2F35I2WN?

The 5SGXMA7K2F35I2WN positions itself where large programmable capacity, significant on-chip memory, and many I/Os are required together with industrial temperature tolerance. It is suited for engineers designing multi-channel, memory-heavy logic systems that must operate reliably across –40°C to 100°C.

This Stratix V GX device provides a balance of integration and performance characteristics that support consolidation of functions into a single FPGA, simplifying system architecture and reducing component count while enabling scalable, robust designs backed by Intel’s Stratix V device family documentation.

Request a quote or submit an inquiry to receive pricing, availability, and assistance specifying this part for your next high-density, industrial FPGA design.