5SGXMA7K2F35I3LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 18 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7K2F35I3LN – Stratix® V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 432 I/Os, 1152-BBGA
The 5SGXMA7K2F35I3LN is a Stratix® V GX field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It delivers high-density programmable logic with 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 432 I/Os for complex system designs.
Targeted at industrial-grade applications, this device supports surface-mount board assembly, operates across a broad temperature range, and accepts a core voltage supply between 820 mV and 880 mV—making it suitable for thermally and electrically demanding deployments.
Key Features
- High-density logic 622,000 logic elements to implement large-scale digital designs and complex IP integration.
- Embedded memory Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive algorithms without immediate external memory dependence.
- Extensive I/O Up to 432 general-purpose I/Os to interface with multiple peripherals, high-pin-count peripherals, and wide parallel buses.
- Industrial temperature grade Rated for operation from -40 °C to 100 °C, suitable for industrial environments that require extended temperature operation.
- Precision core voltage Core supply voltage range of 820 mV to 880 mV to match system power distribution and regulator designs.
- Package and mounting 1152-BBGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35), designed for surface-mount PCB assembly.
- RoHS compliant Manufactured in compliance with RoHS environmental standards.
Typical Applications
- High-density signal processing Use the large logic fabric and substantial on-chip RAM for DSP pipelines, real-time processing, and algorithm acceleration.
- Industrial control and automation Industrial temperature rating and abundant I/Os support motor control, PLC interfacing, and factory automation systems.
- Network and compute infrastructure High logic capacity and many I/Os enable complex packet processing, protocol offload, and custom networking functions.
- Prototype and system integration Flexible programmable fabric and extensive I/O simplify integration of custom logic, interface bridging, and system verification platforms.
Unique Advantages
- Scale for complex designs: 622,000 logic elements and large embedded memory let you consolidate multiple functions into a single device, reducing BOM and board area.
- Robust I/O capability: 432 I/Os provide the wiring density needed for multi-channel interfaces, wide parallel buses, and numerous peripheral connections.
- Industrial readiness: Operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments common in industrial applications.
- Controlled core power: Narrow core voltage range (820 mV–880 mV) enables predictable power budgeting and regulator selection for high-performance boards.
- Industry-standard packaging: 1152-BBGA FCBGA (35×35) package supports surface-mount manufacturing and established assembly workflows.
- Environmentally compliant: RoHS compliance reduces restrictions on use in regulated manufacturing environments.
Why Choose 5SGXMA7K2F35I3LN?
This Stratix® V GX FPGA combines very high logic density, substantial embedded memory, and a large complement of I/Os in an industrial-temperature, surface-mount package. The device is suited to designers who need to implement complex, high-capacity digital systems while keeping board-level integration and part count under control.
For engineering teams developing industrial automation equipment, high-throughput networking functions, or advanced signal-processing systems, this part offers a balance of performance, integration, and environmental robustness backed by documented device characteristics.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMA7K2F35I3LN.

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