5SGXMA7K2F35I3LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 18 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F35I3LN – Stratix® V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 432 I/Os, 1152-BBGA

The 5SGXMA7K2F35I3LN is a Stratix® V GX field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It delivers high-density programmable logic with 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 432 I/Os for complex system designs.

Targeted at industrial-grade applications, this device supports surface-mount board assembly, operates across a broad temperature range, and accepts a core voltage supply between 820 mV and 880 mV—making it suitable for thermally and electrically demanding deployments.

Key Features

  • High-density logic  622,000 logic elements to implement large-scale digital designs and complex IP integration.
  • Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive algorithms without immediate external memory dependence.
  • Extensive I/O  Up to 432 general-purpose I/Os to interface with multiple peripherals, high-pin-count peripherals, and wide parallel buses.
  • Industrial temperature grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environments that require extended temperature operation.
  • Precision core voltage  Core supply voltage range of 820 mV to 880 mV to match system power distribution and regulator designs.
  • Package and mounting  1152-BBGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35), designed for surface-mount PCB assembly.
  • RoHS compliant  Manufactured in compliance with RoHS environmental standards.

Typical Applications

  • High-density signal processing  Use the large logic fabric and substantial on-chip RAM for DSP pipelines, real-time processing, and algorithm acceleration.
  • Industrial control and automation  Industrial temperature rating and abundant I/Os support motor control, PLC interfacing, and factory automation systems.
  • Network and compute infrastructure  High logic capacity and many I/Os enable complex packet processing, protocol offload, and custom networking functions.
  • Prototype and system integration  Flexible programmable fabric and extensive I/O simplify integration of custom logic, interface bridging, and system verification platforms.

Unique Advantages

  • Scale for complex designs: 622,000 logic elements and large embedded memory let you consolidate multiple functions into a single device, reducing BOM and board area.
  • Robust I/O capability: 432 I/Os provide the wiring density needed for multi-channel interfaces, wide parallel buses, and numerous peripheral connections.
  • Industrial readiness: Operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments common in industrial applications.
  • Controlled core power: Narrow core voltage range (820 mV–880 mV) enables predictable power budgeting and regulator selection for high-performance boards.
  • Industry-standard packaging: 1152-BBGA FCBGA (35×35) package supports surface-mount manufacturing and established assembly workflows.
  • Environmentally compliant: RoHS compliance reduces restrictions on use in regulated manufacturing environments.

Why Choose 5SGXMA7K2F35I3LN?

This Stratix® V GX FPGA combines very high logic density, substantial embedded memory, and a large complement of I/Os in an industrial-temperature, surface-mount package. The device is suited to designers who need to implement complex, high-capacity digital systems while keeping board-level integration and part count under control.

For engineering teams developing industrial automation equipment, high-throughput networking functions, or advanced signal-processing systems, this part offers a balance of performance, integration, and environmental robustness backed by documented device characteristics.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMA7K2F35I3LN.

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