5SGXMA7K2F35I3WN

The 5SGXMA7K2F35I3WN is a Stratix V GX field programmable gate array (FPGA) IC from Intel designed for high-density, industrial-grade applications. It integrates a large fabric of logic elements and embedded RAM alongside extensive I/O to support complex digital designs.

This device is part of the Stratix V GX family and is specified with industrial temperature grading, a compact 1152-BBGA (35×35) package, and a low-voltage core supply range suitable for power-optimized system designs. Refer to the device datasheet for detailed series-level transceiver and timing characteristics.

Key Features

• Logic Capacity  Provides 622,000 logic elements for high-density combinational and sequential logic integration.
• Embedded Memory  Includes approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
• I/O Resources  Offers 432 user I/Os to support wide parallel interfaces and flexible board-level connectivity.
• Transceiver Options (series)  Stratix V GX devices include configurable transceiver speed grades (see the Stratix V device datasheet for available GX channel speed grades documented for the series).
• Power and Core Voltage  Core supply range specified from 820 mV to 880 mV to match low-voltage system power domains.
• Package and Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-speed communications  Use the Stratix V GX series transceiver options alongside the device’s large logic fabric to implement multi-gigabit serial links and protocol processing (see datasheet for series transceiver grades).
• Signal processing and DSP  Large logic capacity and approximately 51.2 Mbits of on-chip RAM enable high-throughput digital signal processing, filtering, and data buffering.
• Prototyping and hardware acceleration  Dense logic and abundant I/Os make this FPGA suitable for prototyping complex SoC functions and offloading compute-heavy tasks in accelerators.
• Industrial control systems  Industrial-grade temperature rating and extensive I/O resource allocation support robust control, monitoring, and interface aggregation in industrial equipment.

Unique Advantages

• Highly integrated logic and memory: A combination of 622,000 logic elements and approximately 51.2 Mbits of embedded RAM reduces the need for external memory and discrete logic, simplifying board design.
• Extensive I/O connectivity: 432 I/Os allow direct interfacing to wide parallel buses, multiple peripherals, and complex board-level I/O requirements.
• Industrial operating range: Specified operation from –40 °C to 100 °C supports deployment in challenging temperature environments common in industrial applications.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package supports high-density PCB layouts while maintaining manufacturability.
• Low-voltage core operation: Core supply between 820 mV and 880 mV enables integration into power-optimized systems.
• RoHS compliant: Meets RoHS requirements for environmental and regulatory considerations.

Why Choose 5SGXMA7K2F35I3WN?

This Stratix V GX FPGA combines substantial logic capacity, significant embedded memory, and broad I/O resources in an industrial-grade, compact package—making it well suited for complex digital designs that require on-chip integration and robust environmental performance. It is appropriate for engineering teams developing high-density processing, communication, and control systems that benefit from scalable FPGA fabric and series-level transceiver options documented in the datasheet.

Choosing this device supports long-term design scalability through its high logic and memory capacity, industrial temperature rating, and the established Stratix V device family documentation for electrical and transceiver characteristics.

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