5SGXMA7K2F35I3G

The 5SGXMA7K2F35I3G is a Stratix V GX field programmable gate array (FPGA) in an 1152-BBGA FCBGA package. It provides large programmable logic capacity and substantial on-chip memory, suited for designs that require high-density logic, extensive embedded RAM, and robust I/O.

As a Stratix V GX device, the series includes high-speed transceiver capability; combined with the part’s 432 I/O and industrial temperature grade, this device is aimed at high-performance and industrial embedded applications that demand scalable logic and reliable operation across a wide temperature range.

Key Features

• Core density  622,000 logic elements for implementing complex digital logic and wide datapath designs.
• Embedded memory  Approximately 51.2 Mbits of embedded memory (51,200,000 total RAM bits) to support buffering, packet processing, and large on-chip datasets.
• I/O capacity  432 device I/O pins to support broad peripheral and interface integration.
• Transceiver capability (series-level)  Stratix V GX devices include GX channel transceiver speed grades (series documentation lists GX channel options up to 14.1 Gbps), providing options for high-speed serial connectivity depending on device configuration.
• Power  Core supply voltage range of 820 mV to 880 mV for defined power planning and core rail design.
• Package and mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35); surface-mount package for standard PCB assembly processes.
• Temperature and grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for applications that require extended temperature operation.
• RoHS compliant  Compliant with RoHS environmental standards.

Typical Applications

• High-speed communications  Use the Stratix V GX family’s transceiver speed grades alongside this device’s high I/O count for serial link interfaces and packet-processing front ends.
• Signal processing and acceleration  Large logic capacity and substantial embedded RAM make this FPGA suitable for datapath acceleration, custom DSP, and hardware-accelerated algorithms.
• Industrial control and automation  Industrial temperature rating and robust packaging support control systems and automation equipment operating across wide temperature ranges.
• Complex SoC integration  High I/O density and on-chip resources enable integration of multiple interfaces and peripheral controllers into a single programmable device.

Unique Advantages

• High logic density: 622,000 logic elements enable implementation of large, multi-function designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and mid-size dataset use cases.
• Robust I/O count: 432 I/O pins simplify board-level connectivity and reduce the need for external I/O expanders.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Defined core voltage window: 820 mV–880 mV supply range provides precise requirements for power-supply design and regulation.
• Surface-mount BBGA packaging: 1152-BBGA (35×35) offers a compact, board-friendly footprint for high-density PCBs.

Why Choose 5SGXMA7K2F35I3G?

The 5SGXMA7K2F35I3G positions itself as a high-density Stratix V GX FPGA option that combines extensive logic resources, sizable embedded memory, and a high I/O count in an industrial-grade package. Its specified core voltage range and surface-mount 1152-BBGA package support straightforward integration into demanding system designs.

Designers requiring large programmable logic fabrics with significant on-chip RAM and broad connectivity—especially for industrial or temperature-sensitive applications—will find this device applicable. The device’s alignment with Stratix V GX series transceiver capabilities also provides a path for high-speed serial implementations where appropriate.

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