5SGXMA7K2F35I2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 171 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F35I2N – Stratix V GX FPGA (622,000 logic elements, 1152‑BBGA)

The 5SGXMA7K2F35I2N is a Stratix® V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. This industrial‑grade FPGA provides a large logic capacity, substantial embedded memory, and a high I/O count for complex programmable logic designs.

Key technical attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 432 I/Os, and a specified core voltage supply range of 870 mV to 930 mV. The device is offered for surface‑mount assembly and rated for operation from −40 °C to 100 °C.

Key Features

  • Core Logic 622,000 logic elements (cells) to implement large-scale digital designs and complex system functions.
  • Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for buffering, data storage, and memory‑intensive logic.
  • I/O Capacity 432 user I/Os to support broad interfacing requirements with peripherals, mezzanine cards, and system buses.
  • Power Core voltage supply specified between 870 mV and 930 mV to match system power‑rail design and sequencing requirements.
  • Package & Mounting 1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), optimized for surface‑mount PCB assembly.
  • Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature‑challenging environments.
  • Regulatory Compliance RoHS‑compliant to meet environmental and manufacturing requirements.

Unique Advantages

  • Large programmable capacity: 622,000 logic elements provide the resources needed for complex logic, state machines, and custom accelerators without external glue logic.
  • Substantial on‑chip RAM: Approximately 51.2 Mbits of embedded memory reduce dependence on external memory for buffering and data processing.
  • High I/O count: 432 I/Os enable flexible interfacing to multiple subsystems, sensors, and high‑pin‑count connectors.
  • Industrial temperature range: Rated from −40 °C to 100 °C for deployment in industrial and temperature‑variable applications.
  • Compact FCBGA package: 1152‑BBGA (35×35) strikes a balance between integration density and board‑level routing for space‑constrained designs.
  • Low‑voltage core compatibility: Core supply between 870 mV and 930 mV supports modern low‑voltage system architectures.

Why Choose 5SGXMA7K2F35I2N?

The 5SGXMA7K2F35I2N positions itself as a robust, industrial‑grade FPGA option where large logic capacity, significant embedded memory, and extensive I/O are required. Its specification set makes it appropriate for designs that demand a high degree of programmability combined with thermal margin and compact board footprint.

Designed to be incorporated into complex digital systems, this Stratix V GX device offers a balance of integration and operational specification clarity that supports scalable designs and long‑term deployment. RoHS compliance and surface‑mount packaging simplify manufacturing and supply‑chain integration.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery information for 5SGXMA7K2F35I2N.

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