5SGXMA7K2F35C3WN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 742 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F35C3WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA7K2F35C3WN is a Stratix® V GX family FPGA delivered in a high-density 1152-ball BGA package. It provides substantial on-chip logic and memory resources alongside a large I/O count for complex, high-integration digital designs.

Designed for commercial applications, this device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 432 user I/Os, enabling system architects to implement large-scale logic, buffering, and interfacing within a single programmable device.

Key Features

  • High Logic Density  622,000 logic elements to implement complex control, signal processing, and custom compute functions on-chip.
  • Substantial Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large FIFOs, frame buffers, and intermediate data storage.
  • Large I/O Count  432 user I/Os for flexible interfacing with peripherals, memory, and high-pin-count system designs.
  • Power Supply  Rated voltage supply range of 820 mV to 880 mV, providing the device operating envelope for system power design.
  • Package & Mounting  1152-ball BGA (FCBGA); supplier package listed as 1152-FBGA (35×35). Surface-mount mounting type supports compact board-level integration.
  • Commercial Temperature Grade  Operating temperature range 0 °C to 85 °C, suitable for commercial applications and environments.
  • Regulatory Compliance  RoHS compliant for reduced environmental impact and global supply compatibility.

Unique Advantages

  • High integration in a single device: 622,000 logic elements and ~51.2 Mbits of embedded memory reduce external component count and PCB complexity.
  • Flexible system interfacing: 432 I/Os allow direct connection to multiple peripherals, buses, and memory interfaces without extensive multiplexing.
  • Space-efficient packaging: 1152-ball BGA (35×35) enables dense board designs while keeping the FPGA footprint manageable for compact systems.
  • Commercial-focused thermal envelope: 0 °C to 85 °C rating aligns with standard commercial hardware deployments and design cycles.
  • Controlled supply requirements: Defined voltage supply range (820–880 mV) simplifies power delivery planning for consistent device operation.
  • Environmentally compliant: RoHS compliance supports regulatory and sustainability requirements in procurement and manufacturing.

Why Choose 5SGXMA7K2F35C3WN?

This Stratix® V GX FPGA delivers a balance of very large logic capacity, substantial embedded memory, and high I/O density in a surface-mount BGA package targeted at commercial applications. It is suited to designs that require consolidation of complex digital functions, large buffers or packet storage, and broad interfacing capability within a single programmable device.

For engineering teams focused on high-integration digital systems, the 5SGXMA7K2F35C3WN offers a clear path to reduce BOM complexity, maintain a compact board footprint, and meet defined power and thermal conditions while leveraging the Stratix V family architecture.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA7K2F35C3WN.

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