5SGXMA7K2F35C3G

The 5SGXMA7K2F35C3G is a Stratix V GX field-programmable gate array from Intel, delivered in a 1152-BBGA (35 × 35 mm) FCBGA package for surface-mount applications. This device provides very large logic capacity and on-chip memory along with the I/O density required for complex, memory- and I/O-intensive designs.

Designed as part of the Stratix V GX family, the device benefits from the family’s documented electrical and switching characteristics, including transceiver and I/O timing information. It is targeted at commercial-temperature applications that require high integration and substantial programmable logic and embedded RAM resources.

Key Features

• Logic Capacity  622,000 logic element cells for large-scale programmable logic and custom digital processing.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive functions.
• I/O Resources  432 user I/Os to support broad peripheral connectivity and multi-channel interfacing.
• Transceiver Family Characteristics  Part of the Stratix V GX family; family documentation covers transceiver specifications and I/O timing (including programmable I/O element delay and programmable output buffer delay).
• Power Supply  Core supply operating range: 820 mV to 880 mV.
• Package and Mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35 mm); surface-mount mounting type for PCB assembly.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant.

Typical Applications

• High-density digital processing  Large logic capacity and substantial embedded RAM enable complex custom datapath and control logic implementations.
• Memory-intensive designs  Approximately 51.2 Mbits of on-chip RAM supports buffering, packet handling, and large LUT implementations.
• Multi-I/O systems  432 I/Os accommodate broad peripheral interfacing, multi-channel sensor or control connectivity, and board-level integration.

Unique Advantages

• High logic integration: With 622,000 logic element cells, the device consolidates large-scale functions into a single FPGA, reducing external component count.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM allows for substantial local storage for buffering and algorithm acceleration.
• Substantial I/O capacity: 432 user I/Os provide the pin count needed for complex board-level interfacing and dense I/O requirements.
• Optimized power envelope: A defined core supply range of 820 mV–880 mV supports low-voltage core operation as documented in device electrical specifications.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and supplied in a 1152-FBGA package suited for modern surface-mount assembly.
• Standards-conscious manufacturing: RoHS compliance simplifies environmental and regulatory considerations for commercial products.

Why Choose 5SGXMA7K2F35C3G?

The 5SGXMA7K2F35C3G delivers a combination of very large logic density, extensive embedded RAM, and rich I/O resources in a single commercial-temperature FPGA package. It is suited to engineering teams that need to implement large-scale, memory-hungry, and I/O-dense designs while leveraging the documented electrical and transceiver characteristics of the Stratix V GX family.

Choosing this device provides a scalable platform backed by Intel’s Stratix V family documentation and device electrical data—useful for design planning, timing analysis, and system integration in commercial applications.

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