5SGXMA7K2F35C2LG

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 359 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F35C2LG – Stratix® V GX FPGA IC, 622,000 logic elements

The 5SGXMA7K2F35C2LG is an Intel Stratix® V GX field programmable gate array (FPGA) IC delivering high-density programmable logic and on-chip memory in a 1152-BBGA FCBGA package. This commercial-grade device is designed for applications that require large logic capacity, substantial embedded RAM, and a high I/O count within a surface-mount package.

Manufactured by Intel, the device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 432 I/Os, providing a platform for complex, high-capacity FPGA designs that operate across a defined commercial temperature range.

Key Features

  • Core Logic  622,000 logic elements for dense, programmable logic implementation and large-scale designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large data buffers, state machines, and algorithm implementations.
  • I/O Capacity  432 I/O pins to enable extensive interfacing and connectivity in system-level designs.
  • Package & Mounting  1152-BBGA (FCBGA) supplier package; 1152-FBGA (35×35) footprint, surface-mount mounting for compact board integration.
  • Power  Core voltage supply range of 820 mV to 880 mV to match low-voltage system requirements.
  • Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant, meeting common environmental regulatory requirements for lead-free assembly.

Unique Advantages

  • High logic density: 622,000 logic elements allow implementation of complex, large-scale logic and custom accelerators without immediate partitioning across multiple devices.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces external memory dependency for many designs, streamlining board-level BOM.
  • Extensive I/O resources: 432 I/Os provide flexibility for multi-channel interfaces, parallel peripherals, and rich system integration.
  • Compact, manufacturable package: 1152-BBGA (35×35) FCBGA surface-mount package supports high pin count in a defined footprint for production assembly.
  • Low-voltage core operation: 820–880 mV supply range aligns with modern low-voltage power architectures used in dense programmable logic solutions.
  • Commercial temperature rating: Engineered for systems operating across a 0 °C to 85 °C range, suitable for a wide range of commercial electronic applications.

Why Choose 5SGXMA7K2F35C2LG?

The 5SGXMA7K2F35C2LG positions itself as a high-capacity Stratix V GX FPGA option for designers who need large logic resources, significant on-chip memory, and extensive I/O in a single, surface-mount package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 432 I/Os provides a robust foundation for complex system designs that demand integration and scale.

With commercial temperature rating and RoHS compliance, this Intel-manufactured device offers a practical balance of performance, integration, and manufacturability for demanding commercial FPGA designs. It is well suited to teams evaluating solutions that require concentrated logic and memory resources in a compact form factor.

Request a quote or submit a quote to evaluate 5SGXMA7K2F35C2LG for your design and procurement requirements.

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