5SGXMA7K2F35C2

The 5SGXMA7K2F35C2 is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, programmable logic applications. The device integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory, delivering capacity for complex digital designs that require significant on-chip resources.

Packaged in a 1152-BBGA (FCBGA) format with a supplier package of 1152-FBGA (35×35), and featuring 432 I/O pins, this commercial-grade FPGA targets applications that need large I/O counts and substantial embedded RAM while operating within a 0 °C to 85 °C temperature range and a core supply of 870 mV to 930 mV.

Key Features

• Logic Capacity  622,000 logic elements provide the programmable fabric required for complex state machines, datapaths, and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM supports significant buffering, FIFOs, and memory-intensive algorithms without relying on external memory.
• I/O Density  432 general-purpose I/O pins allow for broad connectivity to peripherals, sensors, and multi-channel interfaces.
• Powering  Core voltage range of 870 mV to 930 mV enables integration into low-voltage system architectures.
• Package & Mounting  1152-BBGA (FCBGA) package — supplier package listed as 1152-FBGA (35×35) — in a surface-mount form factor suitable for compact, board-level integration.
• Commercial Grade  Rated for commercial operating temperatures from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density logic implementations  Suited for designs that require large programmable fabrics, such as custom datapath engines and complex state machines, leveraging 622,000 logic elements.
• Memory-intensive algorithms  Embedded memory of approximately 51.2 Mbits supports buffering, streaming data processing, and on-chip storage for low-latency workflows.
• Multi-channel I/O systems  432 I/Os enable interfacing with numerous sensors, peripherals, or parallel data lanes for high-channel-count applications.
• Compact, board-level integration  The 1152-BBGA (FCBGA) surface-mount package is intended for space-constrained PCBs where high integration is required.

Unique Advantages

• High on-chip resource density: 622,000 logic elements and substantial embedded RAM reduce the need for external logic and memory, simplifying system architecture.
• Broad I/O capability: 432 I/Os enable flexible system partitioning and rich peripheral interfacing without additional I/O expanders.
• Compact package delivery: 1152-BBGA (FCBGA) in a 1152-FBGA (35×35) supplier package provides a dense, surface-mount footprint for integration into modern boards.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with low-voltage power domains common in advanced designs.
• Commercial temperature rating: Operation across 0 °C to 85 °C fits standard commercial product environments.
• RoHS compliant: Supports environmental compliance requirements for manufacturing and end products.

Why Choose 5SGXMA7K2F35C2?

The 5SGXMA7K2F35C2 delivers a balance of high logic density, substantial embedded memory, and broad I/O in a compact FCBGA package, making it suitable for developers tackling complex, memory- and I/O-heavy FPGA designs. Its commercial temperature rating and RoHS compliance make it a practical choice for mainstream electronics applications that demand significant on-chip resources and a compact board footprint.

Choose this Stratix V GX device when your project requires a programmable platform with large capacity, flexible interfacing, and integration into low-voltage system environments—providing a scalable foundation for advanced digital designs.

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