5SGXMA7K2F40C3

The 5SGXMA7K2F40C3 is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory in a high-density FCBGA package.

Designed for commercial-grade applications, this device offers a high I/O count (696 I/Os) and a low-voltage core supply range (820 mV to 880 mV). The Stratix V device datasheet documents the device's electrical and switching characteristics, I/O timing, and operating conditions.

Key Features

• Core Capacity  Provides 622,000 logic elements for large programmable logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic.
• I/O Density  696 I/Os to enable dense external connectivity and complex interface implementations.
• Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power architectures that require low-voltage FPGA cores.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Documentation  Device datasheet covers electrical and switching characteristics, I/O timing, programmable I/O delays, and operating conditions for Stratix V devices.

Typical Applications

• Custom FPGA-based systems  Suitable for designs that require large logic capacity and significant on-chip memory for custom processing pipelines.
• High-density I/O interfaces  Ideal where a large number of external signals and peripherals must be connected directly to programmable logic.
• Prototyping and complex logic integration  Use in development platforms that need substantial logic elements and embedded RAM for validation and system integration.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable complex control, processing, and glue-logic implementations without external ASICs.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path requirements.
• High I/O count: 696 I/Os allow dense connectivity to sensors, transceivers, and peripherals, simplifying board-level routing for complex systems.
• Compact, surface-mount package: 1517-BBGA (FCBGA) in a 40×40 supplier footprint supports compact system designs with high pin density.
• Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial environments.
• Regulatory compliance: RoHS compliant to meet common environmental and manufacturing requirements.

Why Choose 5SGXMA7K2F40C3?

The 5SGXMA7K2F40C3 combines substantial logic capacity, large embedded memory, and a high I/O count in a commercial-grade Stratix V GX FPGA package. Its low-voltage core range and surface-mount FCBGA packaging make it suitable for compact, high-density designs that require on-chip resources and connectivity.

This device is appropriate for teams building complex programmable systems that need to scale logic and memory capacity while maintaining a compact board footprint. Technical details and operating characteristics are available in the Stratix V device datasheet to support design-in and validation.

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