5SGXMA7K2F40C3WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 435 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F40C3WN – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA7K2F40C3WN is a Stratix® V GX FPGA IC designed for high-density, programmable logic applications. As a member of the Stratix V GX family, it combines large logic capacity and abundant on-chip memory with high-speed transceiver capability and commercial-grade operating conditions.

This device targets designs that require substantial logic resources, significant embedded RAM, and extensive I/O connectivity while maintaining compliance with RoHS and standard commercial temperature operation.

Key Features

  • Core Logic  Approximately 622,000 logic elements for complex, high-density logic implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, frame storage, and local data buffering.
  • I/O Capacity  696 user I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count designs.
  • Transceiver Capability (Family)  Stratix V GX devices are offered with transceiver speed grades; GX channels support up to 14.1 Gbps depending on selected speed grade, as documented in the device family datasheet.
  • Power  Core voltage supply range of 820 mV to 880 mV for device core operation.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mountable for high-density PCB implementations.
  • Temperature & Grade  Commercial grade device rated for 0°C to 85°C operation.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density signal processing  Large logic count and ~51.2 Mbits of embedded RAM enable DSP pipelines, packet processing, and complex algorithm implementation.
  • High-throughput communications  GX-family transceiver speed grades (up to 14.1 Gbps in some grades) support high-speed serial links when paired with appropriate transceiver-grade devices.
  • Large I/O interface designs  696 I/O pins support wide parallel buses, multiport interfaces, and mixed signaling on a single device.
  • Complex system integration  High logic and memory capacity allow integration of multiple subsystems—reducing external component count in board-level designs.

Unique Advantages

  • Substantial logic capacity: Approximately 622,000 logic elements support large, partitioned designs and allow consolidation of multiple functions into a single FPGA.
  • Significant embedded RAM: Approximately 51.2 Mbits of on-chip memory enables on-device buffering, state machines, and data-intensive processing without immediate external memory dependence.
  • Extensive I/O resources: 696 I/Os simplify board routing for multi-interface systems and reduce the need for external multiplexing.
  • Commercial temperature rating: 0°C to 85°C operating range suited for mainstream electronics and controlled-environment applications.
  • Compact, high-density package: 1517-BBGA (40×40) FCBGA package supports high pin-count implementations in space-constrained PCBs.
  • RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA7K2F40C3WN?

The 5SGXMA7K2F40C3WN provides a balance of very large logic capacity, substantial embedded memory, and extensive I/O in a commercial-grade Stratix V GX FPGA. It is suitable for teams building complex, integrated digital systems that require on-chip resources to minimize external components and simplify system architecture.

With a documented family-level support for high-speed transceivers and a compact FCBGA package, this device is positioned for demanding FPGA implementations where logic density, memory, and I/O scalability matter. RoHS compliance and standard commercial temperature ratings make it appropriate for a wide range of production electronics.

Request a quote or submit a purchase inquiry to obtain pricing, lead-time, and availability for the 5SGXMA7K2F40C3WN.

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