5SGXMA7K2F40I2G

The 5SGXMA7K2F40I2G is a Stratix V GX field programmable gate array (FPGA) from Intel, packaged in a 1517-BBGA (FCBGA) footprint. With 622,000 logic elements and a high 696-pin I/O count, this device is targeted at designs that require very high logic density and extensive external connectivity.

Key attributes include approximately 51.2 Mbits of embedded memory, industrial temperature rating, and low-voltage core operation, enabling deployment in robust, high-capacity FPGA systems.

Key Features

• Core Logic – 622,000 logic elements provide substantial programmable logic capacity for complex algorithms, signal processing, and large-scale FPGA implementations.
• Embedded Memory – Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions without external RAM.
• I/O Density – 696 I/O pins to support broad peripheral connectivity and multi-channel interfacing on demanding boards.
• Power Supply – Core voltage supply range of 870 mV to 930 mV for defined low-voltage operation and power planning.
• Package – 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40) for board-level footprint and assembly planning.
• Temperature & Grade – Industrial-grade device rated for operation from −40 °C to 100 °C to suit temperature-hardened applications.
• Regulatory – RoHS compliant.
• Surface Mount – Surface-mount device for standard PCB assembly processes.

Typical Applications

• High-density signal processing: Large logic capacity and abundant embedded memory make this device suitable for complex DSP, compression, and real-time processing pipelines.
• Telecommunications and networking: High I/O count supports multi-channel interfaces and dense board-level connectivity for switching, packet processing, and protocol handling.
• Industrial systems: Industrial temperature rating and robust packaging support deployment in rugged control, automation, and instrumentation equipment.
• Prototyping and system integration: Substantial logic and memory resources allow system architects to consolidate functions and validate high-complexity designs.

Unique Advantages

• Highly integrated logic: 622,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM lowers dependence on external memory and improves throughput for buffer-heavy designs.
• Extensive I/O resources: 696 I/Os provide flexibility to connect numerous peripherals, mezzanines, or high-pin-count interfaces without external multiplexing.
• Industrial operating range: −40 °C to 100 °C rating enables reliable operation in temperature-challenging environments.
• Low-voltage core operation: 870–930 mV supply range allows targeted power budgeting and thermal planning for high-density implementations.
• RoHS compliant: Meets lead-free and environmental compliance requirements for modern manufacturing.

Why Choose 5SGXMA7K2F40I2G?

The 5SGXMA7K2F40I2G delivers a combination of very high logic capacity, substantial embedded memory, and a large I/O count in a 1517-BBGA package, making it well suited for systems that demand consolidation of complex functions into a single FPGA. Its industrial temperature rating and defined low-voltage core range support durable designs with predictable power and thermal profiles.

This device is appropriate for engineering teams building high-density signal processing, networking, and industrial control solutions that require scalability, robust operation, and a high degree of integration.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for incorporating the 5SGXMA7K2F40I2G into your next design.