5SGXMA7K2F40C3N

The 5SGXMA7K2F40C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1517-BBGA FCBGA package. This commercial-grade FPGA provides large on-chip resources including 622,000 logic elements and approximately 51.2 Mbits of embedded memory, together with 696 user I/Os.

Designed for surface-mount PCB assemblies, the device operates from a core supply range of 820 mV to 880 mV and is specified for an ambient operating temperature range of 0 °C to 85 °C. RoHS compliance is specified.

Key Features

• Logic Capacity  Provides 622,000 logic elements for implementing high-density logic and complex digital functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and block-memory needs.
• I/O Resources  696 user I/O pins to support wide parallel interfaces and multiple I/O banks.
• Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for high-pin-count board designs.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for core power planning and regulation design.
• Operating Conditions  Commercial-grade temperature rating with an operating range of 0 °C to 85 °C.
• Environmental  RoHS compliant.

Unique Advantages

• High integration density: 622,000 logic elements enable consolidation of complex functions that reduce external component count.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory supports large buffers and memory-mapped designs without external RAM.
• Large I/O complement: 696 I/Os provide flexibility for multi-protocol interfacing and parallel data paths.
• High pin-count package: The 1517-BBGA (1517-FBGA, 40×40) package delivers a compact footprint with extensive signal routing capacity for dense PCBs.
• Low-voltage core: Specified core supply of 820–880 mV assists in designing efficient power distribution networks for the FPGA core.

Why Choose 5SGXMA7K2F40C3N?

The 5SGXMA7K2F40C3N is positioned for designs that require substantial programmable logic, large embedded memory, and a high count of I/Os in a single commercial-grade FPGA. Its combination of logic capacity, on-chip RAM, and package density makes it suitable for systems requiring consolidated digital processing and complex interfacing while maintaining a surface-mount, high-pin-count footprint.

Choosing this Stratix V GX device offers a clear pathway for scalable, high-density FPGA implementations where integration and on-chip resources reduce bill-of-materials and simplify board-level architecture. The specified electrical and thermal parameters provide concrete constraints for power and thermal planning in commercial-temperature applications.

Request a quote or submit a pricing and availability inquiry to evaluate the 5SGXMA7K2F40C3N for your next design.