5SGXMA7K2F40I2LG

The 5SGXMA7K2F40I2LG is a Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers a high on-chip resource count for demanding designs with 622,000 logic elements and approximately 51.2 Mbits of embedded memory.

Designed and specified for industrial-temperature operation, this device supports large I/O counts and tight power rails, making it suitable for dense digital implementations that require substantial logic, memory, and I/O integration.

Key Features

• Core Logic  622,000 logic elements to implement large-scale, complex digital logic and custom hardware accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for large buffering, state storage, and memory-dense algorithms.
• I/O Capacity  696 I/O pins to support extensive peripheral interfacing, parallel buses, and multi-channel I/O requirements.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type.
• Power  Core supply range specified at 820 mV to 880 mV for core power planning and supply design.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for systems requiring extended temperature capability.
• RoHS Compliant  Device meets RoHS requirements for environmentally conscious designs.

Typical Applications

• High-density digital systems  Implement large custom logic functions and hardware accelerators using the device’s 622,000 logic elements and substantial on-chip memory.
• I/O‑intensive designs  Leverage up to 696 I/O pins for multi-channel interfaces, wide parallel buses, or extensive peripheral connectivity.
• Industrial equipment  Industrial-temperature rating (−40 °C to 100 °C) supports deployment in factory, infrastructure, and harsh-environment systems.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O support: 696 I/O pins enable complex interfacing without sacrificing routing or board-level resources.
• Industrial-grade thermal range: Specified operation from −40 °C to 100 °C supports reliable performance in temperature-challenging environments.
• Compact surface-mount package: 1517-BBGA (1517-FBGA, 40×40 supplier package) balances high pin count with a manufacturable surface-mount format.
• Defined core power envelope: Core voltage range of 820 mV–880 mV supports predictable power-supply design and margining.

Why Choose 5SGXMA7K2F40I2LG?

The 5SGXMA7K2F40I2LG positions itself as a high-density Stratix V GX FPGA option when large logic capacity, significant embedded memory, and broad I/O are required within an industrial-temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 I/O pins makes it well-suited to complex digital systems that demand integration and determinable power requirements.

For engineering teams designing industrial or high-capacity logic systems, this device provides a clear specification set for resource planning, thermal margining, and board-level packaging decisions while maintaining RoHS compliance.

If you would like pricing, availability, or to request a quote for 5SGXMA7K2F40I2LG, please submit an inquiry or request a quote through your preferred procurement channel.