5SGXMA9K2H40C3N

The 5SGXMA9K2H40C3N is an Intel Stratix V GX series FPGA in a 1517-BBGA (FCBGA) package. It delivers high logic capacity and on-chip memory for designs requiring substantial programmable logic resources and extensive I/O.

Built as a commercial-grade Stratix V GX device, this part combines 840,000 logic elements with approximately 53.25 Mbits of embedded memory and up to 696 I/O pins, supporting applications that need dense logic and broad interfacing in a surface-mount FCBGA package.

Key Features

• FPGA Architecture – Stratix V GX Series-level architecture provides the GX family feature set as documented in the Stratix V device datasheet.
• Logic Capacity 840,000 logic elements and 317,000 logic array blocks (LABs) for large, complex logic implementations.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, packet buffering, and data/state storage.
• Extensive I/O 696 I/O pins to accommodate wide parallel interfaces and multi-channel connectivity.
• Power Supply Range Core voltage supply specified from 820 mV to 880 mV.
• Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type.
• Commercial Temperature Grade Operating temperature range from 0 °C to 85 °C (commercial grade).
• Regulatory RoHS compliant.
• Series Transceiver Grades (Series-level) Stratix V GX family documentation includes GX transceiver speed grades up to 14.1 Gbps (series-level specification).

Typical Applications

• High-speed serial/transceiver designs Series-level transceiver grades in the Stratix V GX family support high-speed serial channel development and evaluation.
• Compute-intensive custom logic Large logic element and embedded memory resources support complex custom processing, algorithm acceleration, and state machines.
• I/O-rich systems The high I/O count enables wide parallel interfaces and dense peripheral connectivity for multi-channel designs.

Unique Advantages

• High logic density: 840,000 logic elements provide the capacity needed for large FPGA designs and complex feature integration.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces the need for external buffering and simplifies board-level memory architecture.
• Large I/O complement: 696 I/Os offer flexibility for interfacing with multiple peripherals, buses, and parallel data paths.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation, suitable for commercial-environment deployments.
• Surface-mount FCBGA packaging: 1517-ball FCBGA (45×45 supplier package) supports compact, high-density board designs.
• RoHS compliant: Conforms to RoHS requirements for lead-free production environments.

Why Choose 5SGXMA9K2H40C3N?

The 5SGXMA9K2H40C3N pairs the Stratix V GX family feature set with industry-grade capacity: hundreds of thousands of logic elements, multi-megabit embedded memory, and a high I/O count in a compact FCBGA footprint. Its commercial-grade temperature range and RoHS compliance make it suitable for a wide range of board-level designs where dense programmable logic and extensive interfacing are required.

This part is appropriate for engineers and teams looking to integrate substantial programmable logic and on-chip memory into compact surface-mount designs while leveraging the documented Stratix V GX series capabilities.

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