5SGXMA9K2H40C2NCV

The 5SGXMA9K2H40C2NCV is a Stratix V GX family FPGA in a 1517-BBGA (FCBGA) package designed for high‑capacity programmable logic implementations. It provides a large fabric of 840,000 logic elements and approximately 53.2 Mbits of embedded memory, combined with 696 user I/Os to support dense, I/O‑rich designs.

This commercial‑grade, surface‑mount device targets applications that require significant on‑chip logic and memory resources while operating from a core supply of 870 mV to 930 mV and within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity: 840,000 logic elements for complex digital designs and large-scale algorithm implementation.
• Embedded Memory: Approximately 53.2 Mbits of on‑chip RAM to support deep buffering, large state machines, and data‑intensive processing.
• High I/O Count: 696 available I/Os to enable broad connectivity for high‑density system integration and board‑level interfaces.
• Package Options: 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑HBGA (45×45) for compact, high‑pin‑count mounting.
• Power Supply: Core voltage range of 870 mV to 930 mV to match system power rails and design constraints.
• Mounting & Grade: Surface mount construction in a commercial temperature grade (0 °C to 85 °C).
• Stratix V GX Family Characteristics: Device is part of the Stratix V GX family; datasheet references include electrical and switching characteristics such as transceiver and I/O timing specifications for family‑level design consideration.

Typical Applications

• High‑bandwidth communications: Use the Stratix V GX family transceiver and I/O capabilities together with high logic and memory capacity to implement multi‑gigabit interface logic and protocol processing.
• Signal processing and compute acceleration: Large logic fabric and substantial embedded RAM enable implementation of computationally intensive DSP and acceleration pipelines.
• System integration and prototyping: High I/O count and compact FCBGA package support dense board connections for system‑level validation and integration.

Unique Advantages

• Substantial programmable fabric: 840,000 logic elements reduce the need for external ASICs or multiple devices when implementing large designs.
• Ample on‑chip memory: Approximately 53.2 Mbits of embedded RAM provides on‑chip buffering and data storage to simplify system memory architectures.
• High I/O density: 696 I/Os allow direct interfacing to a wide range of peripherals and high‑speed connectors, minimizing additional I/O expanders.
• Compact, high‑pin package: 1517‑BBGA (1517‑HBGA supplier package, 45×45) balances large pin count with a compact board footprint for dense designs.
• Defined operating envelope: Commercial grade operation from 0 °C to 85 °C and a specified core voltage range (870 mV–930 mV) support predictable system design and power planning.

Why Choose 5SGXMA9K2H40C2NCV?

The 5SGXMA9K2H40C2NCV combines a very large logic element count, substantial embedded memory, and a high I/O complement in a compact FCBGA package, making it well suited for designs that demand extensive on‑chip resources and dense connectivity. Its defined core voltage range and commercial temperature rating provide a clear electrical and environmental specification for system integration.

This device is appropriate for engineering teams building high‑bandwidth communications, advanced signal processing, or complex prototyping platforms that require scalable logic and memory capacity in a single programmable device.

Request a quote or submit an inquiry to purchase the 5SGXMA9K2H40C2NCV for your next design—provide your quantity and delivery requirements to receive pricing and lead‑time details.