5SGXMA9K2H40I2LG

The 5SGXMA9K2H40I2LG is a Stratix® V GX-series FPGA from Intel, offered in a 1517-BBGA (FCBGA) package. It delivers a high logic capacity and substantial on-chip RAM in an industrial-grade, surface-mount package suitable for designs that require dense logic, large embedded memory, and extensive I/O.

Key device characteristics include 840,000 logic elements, approximately 53 Mbits of embedded memory, and up to 696 I/O pins, combined with a low-voltage core operating range and an industrial operating temperature window.

Key Features

• Core Logic — 840,000 logic elements (LEs) for implementing large-scale digital designs and complex logic fabrics.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM to support large buffers, FIFOs, and embedded data structures.
• I/O Density — 696 I/O pins to enable broad external device connectivity and multi-channel interfacing.
• Power and Supply — Core voltage supply range of 820 mV to 880 mV (0.82–0.88 V) to match modern FPGA power-rail architectures.
• Package — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45) for high-pin-count system integration.
• Mounting and Compliance — Surface-mount device, RoHS compliant.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for industrial environments.
• Documentation — Device belongs to the Stratix V family; datasheet provides electrical and switching characteristics for system design and validation.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and high logic/I/O counts support control systems, complex state machines, and sensor aggregation in factory and process-automation equipment.
• High-Density Digital Processing — Large logic and embedded memory capacity enable implementation of compute-intensive digital signal processing, protocol engines, and packet processing functions.
• System Integration and Prototyping — High I/O pin count and FCBGA package allow consolidation of multiple interfaces and peripherals into a single programmable device for complex system prototypes and custom I/O routing.

Unique Advantages

• High logic capacity: 840,000 logic elements provide substantial room for complex logic, state machines, and custom accelerators, reducing the need for multiple devices.
• Large on-chip memory: Approximately 53 Mbits of embedded RAM enables on-device buffering and dataflow acceleration without extensive external memory.
• Extensive I/O resources: 696 I/Os simplify board-level routing for multi-channel interfaces, sensors, and high-pin-count peripherals.
• Industrial operating range: Rated from –40 °C to 100 °C, suitable for a wide range of industrial environments and deployments.
• Compact, high-pin-count package: 1517-BBGA (1517-HBGA supplier package, 45×45) delivers a high density of signals in a single surface-mount footprint.
• Power-optimized core: Core supply range of 0.82–0.88 V aligns with modern low-voltage power architectures for efficient integration.
• Compliance: RoHS compliant for global environmental requirements.

Why Choose 5SGXMA9K2H40I2LG?

The 5SGXMA9K2H40I2LG positions itself as a high-density Stratix V GX FPGA offering a combination of large logic capacity, significant on-chip memory, and a very high I/O count in an industrial-grade package. These specifications make it well-suited to designers who need to consolidate complex digital functions onto a single programmable device while maintaining robustness across a broad temperature range.

For projects that demand scalable logic resources, substantial embedded RAM, and dense external connectivity, this device provides a verifiable specification set and family-level documentation for electrical and switching characteristics to support system-level design and validation.

If you would like pricing, availability, or a formal quote for the 5SGXMA9K2H40I2LG, request a quote or submit an inquiry through your preferred procurement channel.