5SGXMA9K2H40I3G

The 5SGXMA9K2H40I3G is an Intel Stratix V GX field programmable gate array supplied in a 1517-BBGA FCBGA package. It provides a large logic fabric and extensive I/O in an industrial-grade device intended for designs that require high logic capacity, significant on-chip memory, and broad operating temperature range.

With 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and support for the Stratix V GX transceiver family, this device targets complex digital systems that need dense integration of logic, memory, and I/O resources.

Key Features

• Core Logic  840,000 logic elements to implement large-scale digital designs and system integration.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, packet processing, and local storage.
• I/O Density  Up to 696 user I/O pins to support wide peripheral and system interfacing requirements.
• Transceiver Family (Series)  Part of the Stratix V GX family, which the datasheet lists with multi-gigabit transceiver capability appropriate for serial interface designs.
• Power  Core supply range specified at 820 mV to 880 mV for device operation.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Multi‑gigabit serial systems  Use within Stratix V GX transceiver-enabled designs that require serial interface implementation and high-speed connectivity.
• High-density digital systems  Implement large logic functions and system-on-chip integration where hundreds of thousands of logic elements are needed.
• Industrial embedded platforms  Deploy in industrial applications that benefit from the device's extended −40 °C to 100 °C operating range and high I/O count.
• Memory‑intensive processing  Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet processing, or real-time data handling.

Unique Advantages

• Large logic capacity: 840,000 logic elements enable implementation of complex, high‑density designs and multi-function systems on a single device.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency and simplifies board-level memory architecture.
• High I/O availability: 696 user I/O pins provide flexibility for interfacing to a wide range of peripherals and system interconnects.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in rugged and temperature-variable environments.
• Compact package footprint: 1517-BBGA (1517-HBGA supplier package, 45×45) in a surface-mount form factor eases integration into dense PCBs.
• Standards-compliant: RoHS conformity supports regulatory and environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA9K2H40I3G?

The 5SGXMA9K2H40I3G delivers a balance of high logic density, substantial embedded memory, and robust I/O capacity in an industrial-grade Stratix V GX FPGA package. Its specification set makes it suitable for designs that require consolidated digital logic, significant on-chip buffering, and support for multi‑gigabit transceiver families documented for the Stratix V GX series.

This device is a fit for engineering teams building advanced embedded systems, communications interfaces, and industrial platforms where logic capacity, memory integration, and temperature tolerance are key selection criteria.

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