5SGXMA9K2H40I3LN

The 5SGXMA9K2H40I3LN is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball BGA package designed for industrial-grade applications. It delivers a large fabric capacity and extensive I/O to support high-density logic, on-chip memory, and system-level integration.

Designed for applications that require high logic density and flexible I/O, this Stratix V GX device offers a combination of substantial embedded memory, broad I/O count, and industrial operating range to support demanding embedded and communications designs.

Key Features

• Logic Capacity — 840,000 logic elements to support complex FPGA designs and large-scale integration of custom logic.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) for large buffering, FIFOs, and scratchpad storage.
• I/O Density — 696 user I/O pins to interface with high-pin-count peripherals and multiple simultaneous I/O channels.
• Package & Mounting — 1517-BBGA (FCBGA) supplier device package 1517-HBGA (45×45) with surface-mount assembly for compact board-level integration.
• Power Supply — Core supply range of 820 mV to 880 mV to match targeted power-rail designs and system power domains.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C for use in thermally demanding environments.
• Standards & Compliance — RoHS-compliant manufacturing status.
• Series Transceiver Capability (series-level) — Stratix V GX family documentation lists GX channel speed grades up to 14.1 Gbps depending on transceiver speed grade.

Typical Applications

• High-performance signal processing — Large logic capacity and embedded RAM enable complex DSP pipelines, real-time processing, and algorithm acceleration.
• Telecommunications and networking — High I/O count and series-level GX transceiver capability make the device suitable for switching, protocol processing, and line-card functions.
• Industrial control and automation — Industrial temperature grade and robust package support deployment in factory automation, motion control, and instrumentation systems.
• Prototyping and system integration — Dense logic resources and abundant I/O allow system architects to consolidate multiple functions into a single FPGA for rapid development and reduced board complexity.

Unique Advantages

• High integration density: 840,000 logic elements and substantial on-chip RAM reduce the need for external logic and memory, simplifying BOM and layout.
• Broad I/O capacity: 696 I/O pins provide flexibility for interfacing with many peripherals and parallel data paths without additional bridge logic.
• Industrial-grade operation: −40°C to 100°C rating enables deployment in environments with wide temperature swings and demanding thermal conditions.
• Compact board footprint: 1517-BBGA surface-mount package (45×45) enables high-density PCB layouts for space-constrained systems.
• Power-domain compatibility: Narrow core voltage range (820–880 mV) supports contemporary power-rail designs and energy-optimized system architectures.

Why Choose 5SGXMA9K2H40I3LN?

The 5SGXMA9K2H40I3LN positions itself as a high-capacity, industrial-grade Stratix V GX FPGA that balances large logic resources, abundant embedded memory, and high I/O density in a compact package. It is suited for engineers building complex signal-processing, communications, and industrial systems where integration and thermal resilience matter.

With series-level transceiver capabilities and a robust operating range, this device offers scalability for designs that require both heavy computational logic and extensive interfacing, while keeping system-level component count and board area under control.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA9K2H40I3LN and to discuss how it can fit into your next design.